Xyztec

Productronica China 2025
2025-03-26 - 2025-03-28 | Shanghai New International Expo Centre, 2345 Longyang Rd, Shi Ji Gong Yuan,, Shanghai, Pudong, China
productronica China is dedicated to the entire electronic manufacturing industry chain. Our exhibits cover a wide range of products, presenting one-stop platform of innovative solutions for intelligent manufacturing in the electronics industry via cutting-edge technologies and products.

Electronic Equipment Exhibition 2025
2025-04-16 - 2025-04-18 | TaiNEX 1, No. 1, Jingmao 2nd Road, Taipei City, Nangang District, Taiwan
Electronic Equipment Exhibition is Taiwan’s largest semiconductor and electronic equipment event in the first half of the year. It showcases the latest technologies, products, and solutions in the global semiconductor and electronic manufacturing sectors. Through this exhibition, it actively promotes the localization of the international supply chain and the internationalization of electronic equipment. Exhibitors benefit from targeted networking opportunities, forging lasting partnerships and gaining deep insights into market demands to bolster competitiveness.

At the same time, the exhibition also provides a two-way communication platform, allowing suppliers and buyers to cooperate closely and jointly build a complete supply chain, achieving mutual benefits and win-win results for the industry. This exhibition will be an important opportunity for Taiwan’s semiconductor and electronics industry leap in international stage.

Semicon SEA 2025
2025-05-20 - 2025-05-22 | MBS Singapore

ECTC Dallas 2025
2025-05-27 - 2025-05-29 | Gaylord Texan Resort
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

IMS 2025
2025-06-17 09:30 - 2025-06-19 17:00 UTC | Moscone Center San Francisco, United States
International Microwave Symposium

CSEAC 2025
2025-09-03 - 2025-09-05

SEMICON Taiwan 2025
2025-09-10 - 2025-09-12 | TaiNEX Hall 1&2
Semiconductors are the foundation of the smart future. With its fully-established industry ecosystem and excellent talents in R&D, the Taiwan semiconductor industry is full of potentials and growth momentum in the era of Cloud Economics.
SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies’ marketing and promotion needs.
Visit us at:

Schmidt Taiwan
TaiNEX 1, 1F
K2176

Kingyoup
TaiNEX 1, 4F
M0948

CIOE 2025
2025-09-10 - 2025-09-12 | Shenzhen World Exhibition & Convention Center
The 26th China International Optoelectronic Exposition (CIOE) will be held from September 10 to 12, 2025, at the Shenzhen World Exhibition and Convention Center. As a comprehensive exhibition covering the entire optoelectronics industry chain, CIOE brings together over 3,700 high-quality exhibitors from more than 30 countries and regions worldwide. Co-located with seven events covering sectors such as information and communication, precision optics, laser and intelligent manufacturing, infrared, intelligent sensing, display technologies, etc., CIOE serves as a one-stop efficient procurement platform for industry professionals to source materials, components, equipment, and solutions. Additionally, it is an ideal trade platform for precise one2one business matching, rapid expansion of industry networks, and staying updated with the latest industry trends and developments.

IMAPS Symposium 2025
2025-09-30 - 2025-10-02 | Town & Country Resort

Semicon West 2025
2025-10-07 09:00 - 2025-10-09 17:00 UTC | Phoenix Convention Center | Phoenix, Arizona, Phoenix, United States

Productronica 2025
2025-11-18 - 2025-11-21 | Messe München, Am Messeturm, München, 81829, Germany
World’s Leading Trade Fair for Electronics Development and Production.

Nepcon Japan
2026-01-21 08:00 - 2026-01-23 17:00 UTC
Tokyo Big Sight, Japan

Semicon Korea
2026-02-11 08:00 - 2026-02-13 17:00 UTC
Booth: C762
Korea World Trade Tower, Seoul, Korea

EBL 2026
2026-02-24 08:00 - 2026-02-25 17:00 UTC
Schwabenlandhalle, Fellbach, Germany

IMAPS Device Packaging Conference
2026-03-02 08:00 - 2026-03-05 17:00 UTC
Phoenix, Arizona, USA

Semicon / Productronica China
2026-03-25 08:00 - 2026-03-27 17:00 UTC
SNIEC, Shanghai New International Expo Centre, China

Semicon Southeast Asia
2026-05-05 08:00 - 2026-05-07 17:00 UTC
MITEC, Kuala Lumpur, Malaysia

ECTC: IEEE 76th Electronic Components and Technology Conference
2026-05-26 08:00 - 2026-05-29 17:00 UTC
Orlando, Florida, USA

CSPT
2026-05-27 08:00 - 2026-05-29 17:00 UTC
Wuxi, Jiangsu, China

SNEC
2026-06-03 08:00 - 2026-06-05 17:00 UTC
NECC, Shanghai, China

IMS: IEEE International MTT Symposia
2026-06-09 08:00 - 2026-06-12 17:00 UTC
Boston, Massachusetts, USA

JPCA
2026-06-10 08:00 - 2026-06-12 17:00 UTC

CSEAC
2026-06-10 08:00 - 2026-06-12 17:00 UTC

Nepcon Thailand
2026-06-17 08:00 - 2026-06-20 17:00 UTC
Bitec, Bangkok, Thailand

ICEPT
2026-08-05 08:00 - 2026-08-07 17:00 UTC | Xi’an, China, Xi'an, China
ICEPT (China International Conference on Electronic Packaging Technology) has long been a representative academic and technical exchange platform in the global electronic packaging field and is also regarded as an important international event by the industry. This conference is expected to gather globally renowned wafer fabs, OSAT packaging and testing plants, advanced packaging supply chain, and high-end equipment enterprises, as well as multiple research institutes, to jointly showcase the latest developments in 2.5D/3D packaging, Chiplet integration, interconnect technology, and reliability testing.

In the field of advanced packaging and microelectronic mechanics testing, xyztec is well recognized in both the global and Chinese markets. Its push-pull testing equipment and automation technology continue to provide key support for the reliability verification of Chiplets and heterogeneous integrated components.

During ICEPT 2026, xyztec will collaborate with its core agent in China, ExTripod, to publicly demonstrate its fully automatic push-pull force testing equipment. Live demonstrations will showcase high-precision automated testing capabilities for micro solder joint pull (Wire/Bump Pull) and chip push (Die Shear) applications, assisting sealing and testing operators in improving reliability verification efficiency and process control accuracy.

You are welcome to visit our booth and learn more about our latest bond testing solutions.

PCIM Asia
2026-08-26 08:00 - 2026-08-28 17:00 UTC | Shenzhen World Exhibition & Convention Center (Bao’an Venue), China, Hall 16, Shenzhen, China
PCIM Asia Shenzhen 2026, as an annual event for power electronics, smart sports, and renewable energy management that has been deeply rooted in Asia for more than 20 years, is the core link connecting the industry chain with cutting-edge scientific research achievements.
This exhibition focuses on high-value application areas such as SiC/GaN wide ban charged crystals, power transistor components and modules, automotive electronics/new energy vehicles, and electrified transportation industry chains.

In the field of power transistor and automotive grade device packaging and testing, xyztec has always maintained a leading position in the global and Chinese markets with its powerful high thrust/high tensile testing technology, ultra-high reproducibility accuracy, and ultimate automation integration capabilities, setting an industry benchmark for the packaging reliability of power modules.

At the PCIM Asia Shenzhen 2026 site, xyztec will collaborate with its important agent in China, ExTripod, to publicly showcase its flagship fully automatic push-pull force testing equipment.
A dynamic demonstration will be conducted on site to demonstrate an efficient automated push-pull force testing solution for power modules, including thick aluminum wire/copper strip tension, as well as high-force die shear testing. The demonstration will highlight how these solutions effectively address the quality control challenges associated with high-power device manufacturing.

You are welcome to visit our booth and learn more about our latest bond testing solutions.

Semicon Taiwan 2026
2026-09-02 08:00 - 2026-09-04 17:00 UTC | Taipei Nangang Exibithion Center, No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan, Taipei City, Taiwan
SEMICON Taiwan 2026 will be held at the Nangang Exhibition Center in Taipei in early September, continuing to highlight its position as an important communication platform for the global semiconductor industry.
The exhibition gathers key links such as wafer manufacturing, equipment, materials, advanced packaging, and smart manufacturing, and has become an important indicator for observing the global semiconductor supply chain layout, technological upgrading, and industrial cooperation.

This year’s exhibition mainly focuses on smart manufacturing and advanced packaging, and has established a special zone for wafer smart manufacturing for the first time, showcasing cutting-edge applications such as automation, robotics, digital clones, and industrial AI, reflecting the continuous evolution of the industry towards high efficiency, high integration, and high precision.

xyztec has been deeply involved in wafer level and packaging testing applications, with its main customer base covering top tier customers in semiconductor packaging, wafer level packaging, Chiplets, and high-precision bond testing; In the field of automated testing in Taiwan, xyztec has established a stable market reputation with its automated Bond Tester and integration capabilities.

At Semicon Taiwan xyztec will publicly unveil its latest equipment: the Sigma Nano!
This model focuses on higher positioning accuracy, more precise and stable shear height control, and true corresponding micrometer packaging testing capabilities, targeting the advanced packaging and high-density interconnect application market, which is one of the highlights of this exhibition.

You are welcome to visit booth K2176 on the first floor, and booth N0868 on the fourth floor of the Nangang Exhibition Center.

CIOE
2026-09-09 08:00 - 2026-09-11 17:00 UTC
Shenzhen World Exhibition & Convention Center (Bao’an Venue)，China

IMAPS Symposium
2026-09-28 08:00 - 2026-10-01 17:00 UTC
Encore boston harbor
Boston, Massachusetts, USA

Expo for Electronics Manufacturing (EFX) 2026
2026-10-06 08:00 - 2026-10-08 17:00 (Europe/Helsinki) | Messe Stuttgart, Stuttgart, Germany
