CSPT
2026-05-27 08:00 - 2026-05-29 17:00 UTC | Jiangsu
Wuxi, Jiangsu, China

SNEC
2026-06-03 08:00 - 2026-06-05 17:00 UTC | Jiangsu
NECC, Shanghai, China

IMS: IEEE International MTT Symposia
2026-06-09 08:00 - 2026-06-12 17:00 UTC | Jiangsu
Boston, Massachusetts, USA

JPCA
2026-06-10 08:00 - 2026-06-12 17:00 UTC | Jiangsu
Tokyo Big Sight, Japan

CSEAC
2026-06-10 08:00 - 2026-06-12 17:00 UTC | Jiangsu

Nepcon Thailand
2026-06-17 08:00 - 2026-06-20 17:00 UTC | Jiangsu
Bitec, Bangkok, Thailand

ICEPT
2026-08-05 08:00 - 2026-08-07 17:00 UTC | Xi’an, China, Xi'an, China
ICEPT (China International Conference on Electronic Packaging Technology) has long been a representative academic and technical exchange platform in the global electronic packaging field and is also regarded as an important international event by the industry. This conference is expected to gather globally renowned wafer fabs, OSAT packaging and testing plants, advanced packaging supply chain, and high-end equipment enterprises, as well as multiple research institutes, to jointly showcase the latest developments in 2.5D/3D packaging, Chiplet integration, interconnect technology, and reliability testing.

In the field of advanced packaging and microelectronic mechanics testing, xyztec is well recognized in both the global and Chinese markets. Its push-pull testing equipment and automation technology continue to provide key support for the reliability verification of Chiplets and heterogeneous integrated components.

During ICEPT 2026, xyztec will collaborate with its core agent in China, ExTripod, to publicly demonstrate its fully automatic push-pull force testing equipment. Live demonstrations will showcase high-precision automated testing capabilities for micro solder joint pull (Wire/Bump Pull) and chip push (Die Shear) applications, assisting sealing and testing operators in improving reliability verification efficiency and process control accuracy.

You are welcome to visit our booth and learn more about our latest bond testing solutions.

PCIM Asia
2026-08-26 08:00 - 2026-08-28 17:00 UTC | Shenzhen World Exhibition & Convention Center (Bao’an Venue), China, Hall 16, Shenzhen, China
PCIM Asia Shenzhen 2026, as an annual event for power electronics, smart sports, and renewable energy management that has been deeply rooted in Asia for more than 20 years, is the core link connecting the industry chain with cutting-edge scientific research achievements.
This exhibition focuses on high-value application areas such as SiC/GaN wide ban charged crystals, power transistor components and modules, automotive electronics/new energy vehicles, and electrified transportation industry chains.

In the field of power transistor and automotive grade device packaging and testing, xyztec has always maintained a leading position in the global and Chinese markets with its powerful high thrust/high tensile testing technology, ultra-high reproducibility accuracy, and ultimate automation integration capabilities, setting an industry benchmark for the packaging reliability of power modules.

At the PCIM Asia Shenzhen 2026 site, xyztec will collaborate with its important agent in China, ExTripod, to publicly showcase its flagship fully automatic push-pull force testing equipment.
A dynamic demonstration will be conducted on site to demonstrate an efficient automated push-pull force testing solution for power modules, including thick aluminum wire/copper strip tension, as well as high-force die shear testing. The demonstration will highlight how these solutions effectively address the quality control challenges associated with high-power device manufacturing.

You are welcome to visit our booth and learn more about our latest bond testing solutions.

Semicon Taiwan 2026
2026-09-02 08:00 - 2026-09-04 17:00 UTC | Taipei Nangang Exibithion Center, No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan, Taipei City, Taiwan
SEMICON Taiwan 2026 will be held at the Nangang Exhibition Center in Taipei in early September, continuing to highlight its position as an important communication platform for the global semiconductor industry.
The exhibition gathers key links such as wafer manufacturing, equipment, materials, advanced packaging, and smart manufacturing, and has become an important indicator for observing the global semiconductor supply chain layout, technological upgrading, and industrial cooperation.

This year’s exhibition mainly focuses on smart manufacturing and advanced packaging, and has established a special zone for wafer smart manufacturing for the first time, showcasing cutting-edge applications such as automation, robotics, digital clones, and industrial AI, reflecting the continuous evolution of the industry towards high efficiency, high integration, and high precision.

xyztec has been deeply involved in wafer level and packaging testing applications, with its main customer base covering top tier customers in semiconductor packaging, wafer level packaging, Chiplets, and high-precision bond testing; In the field of automated testing in Taiwan, xyztec has established a stable market reputation with its automated Bond Tester and integration capabilities.

At Semicon Taiwan xyztec will publicly unveil its latest equipment: the Sigma Nano!
This model focuses on higher positioning accuracy, more precise and stable shear height control, and true corresponding micrometer packaging testing capabilities, targeting the advanced packaging and high-density interconnect application market, which is one of the highlights of this exhibition.

You are welcome to visit booth K2176 on the first floor, and booth N0868 on the fourth floor of the Nangang Exhibition Center.

CIOE
2026-09-09 08:00 - 2026-09-11 17:00 UTC | Jiangsu
Shenzhen World Exhibition & Convention Center (Bao’an Venue)，China

IMAPS Symposium
2026-09-28 08:00 - 2026-10-01 17:00 UTC | Jiangsu
Encore boston harbor
Boston, Massachusetts, USA

Expo for Electronics Manufacturing (EFX) 2026
2026-10-06 08:00 - 2026-10-08 17:00 (Europe/Helsinki) | Messe Stuttgart, Stuttgart, Germany

Semicon West
2026-10-13 08:00 - 2026-10-15 17:00 UTC | Jiangsu
Moscone Center, San Francisco, California, USA

PSECE, 21TH Philippine Semiconductor & Electronics Convention and Exhibition
2026-10-26 08:00 - 2026-10-28 17:00 UTC | Jiangsu
SMX Convention Center Manila, Pasay City, Philippines
