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See the unseen with up to 3 live camera options. Bring out the features of interest with images or videos using high-resolution cameras, flexible LED illumination, and fantastic image processing options. Well shot images can be the input for automatic grading.
Precise tool alignment is essential to test the correct bonds correctly. Concentricity correction achieves tool eccentricities less than 5 µm, and unique tool designs can be of help during alignment. We offer solutions in customized hook foot lengths or a self-aligning shear tool, which corrects for any tiny but important angular difference between tool and sample. Using the camera and deep access tooling allows you to test complex sample architecture. Switch between different tools in seconds with our unique rotating 6-in-1 test head RMU.
Define recognizable shapes, patterns, or marks as a global or local reference for positioning and automatic tool alignment. Make sure your sample is in position to test the correct bonds. Fiducials help to correct for any displacements. With camera visualization, it is easy to define recognizable shapes, patterns, or marks as a global or local reference.
Recognition of components and fine pitch wires that are swept out of position due to process tolerances or part handling. Teach the exact position between the first and second bond using camera visualization and the AOI editor. Simply correct missing wires or recognition problems during the automation cycle or after via extensive reports.
一般的なボンドテスターのマニュアル測定では、各測定毎にボンドテスターの実体顕微鏡で破壊モードを確認・記録します。また、微細なサンプルでは必要に応じてオフラインの顕微鏡を使用する必要がありました。Sigmaではこうした通常の方法に加えて、aditionally, operators do the grading after each test. The Sigma offers 2 alternatives to make this process more efficient and consistent.
ウェハバンプシェアテストでは、世界のリーディング企業が自動破壊モード判定を採用しております。画像認識により、シェア後のはんだの残り量を自動検出し、その結果を元に破壊モードを自動判定します。画像認識には半導体・電子部品製造業界で実績豊富なHalcon社の画像処理ライブラリ―を採用。 With deep learning and the advanced Halcon library, we train a neural network to do the image processing for you. By classifying the failure mode criteria beforehand, image recognition is ready to perform automatic grading without any assistance.
Quickly measure manually in captured images by drawing lines or shapes (rectangles, ellipses) and measure:
For more advanced image processing, filtering, segmentation, and detection of shapes, you can use Automated Optical Inspection (AOI). AOI allows you to examine test results and to measure features between objects, and angles.
測定データ・レポートは自動生成・出力。ファイル、シリアルポート、クリップボードへのエクスポート、SECS/GEMに対応。
測定結果、画像、測定条件、測定データ等のSECS/GEM双方向通信に対応します。（オプション）
世界中の支店・代理店がお客様をサポート
オランダ
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
ドイツ
Am Haupttor / Bürocenter
06237
Leuna
Germany
アメリカ
アジア・環太平洋
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
台湾
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
蘇州
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
Xyztec社は業界をリードするボンドテスターメーカーです。世界の半導体・電子部品製造拠点を支店・代理店網でカバーしております。
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Herbert Stuermann
