How to Wire Pull

How to Wire Pull


As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A pull test is the most common test to perform on a bond tester. That is why we have given our well-known wire pull guide an update and a new look. Dig into this new version of “How to Wire Pull” and learn about how to perform an optimal pull test on wires and ribbons.


This extensive how-to consists of 11 paragraphs and 4 appendices. The focus of this manual is on wire- and ribbon pulls using wire hooks or tweezers.

We touch on topics like what type of wires to test, tool design, and tool alignment. But most important; Where to pull?

The guide also covers Loop height measurement and variants on wire pull, such as vector pull and SMD gull-wing leads pull.

At last, we explain some test method settings and share the most common failure modes for gold wire and aluminum wires.

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What is Wire Pull?

Wire pull testing applies an upward force under gold, aluminum, or copper wires or ribbons and effectively pulling the wire away from the substrate or die. The bond tester moves the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).

The purpose of wire pull testing is to measure bond strength, evaluate bond failure modalities, or determine compliance with specified bond strength requirements.


Bond testing guidelines

Besides the how-to on Wire Pull (WP), we offer guides on how-to Cold Bump Pull (CBP) and Tweezer Pull (TP) and access to the relevant MIL-STD-883 standards. Feel free to use these guides to bond testing. Also, please reach out if you have any comments or specific questions regarding the application or your samples.


How to Wire Pull

This how-to on wire pull (WP) guides what to consider and how to perform a correct wire pull test. The main focus of this manual is on wire and ribbon pulls using wire hooks. Loop height measurement is also covered.

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How to Cold Bump Pull

This how-to on Cold Bump Pull (CBP) guides what to consider and how to set up a correct Cold Bump Pull (CBP) test. It generally refers to solder ball testing, but the principles apply equally to most bump testing.

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How to Tweezer Pull

This how-to on Tweezer Pull (TP) guides what to consider and how to perform a Tweezer Pull test or a Tweezer Peel test. Tweezer pull and peel tests usually are not challenging to do if you own the right equipment.

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Other test types 

Find out what test types are configurable for your applications. In this overview, you will find all test types to perform on a Sigma bond tester. Click on your test type to read more about a specific test type.

Cold bump pull (CBP) Ball on ring Film Cavity shear Auto grading Cantilever beam
Copper pillar pull Bending Adhesives Copper pillar shear Loop height Creep
Lid pull Connector push Ribbon Copper tab/conductor Optical Deep access
Ribbon pull Keypad Die shear Probe Fatigue
SMD component pull Gold/copper ball shear Lead integrity/micro torsion
SMD gull wing pull Overhanging die shear Lid torque
Stud (die) pull Passivation layer shear Scratch/coating
Tweezer pull Ribbon shear Spring rigidity
Vector pull Solder ball shear
Wire pull SMD component shear
Total ball shear/zone shear
Wedge shear


Quickstart Manuals

The new Sigma software manuals are available on the website or to download as PDF files below.


The Wiki of bond testing

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Clyde Chen