How to test bonds » Lead integrity » MIL-STD-883 method 2004.7 lead integrity

Page 9/9: Test condition E - Lead plating integrity

  1. PURPOSE

    This test is designed to check the lead plating of flexible and semi-flexible leads which might reasonably be expected to occur from a lead form operation.

    Note: Additional plating adhesion accept/reject criteria may be flowed down by the specified plating specifications.

  2. APPARATUS

    Attaching devices, clamps, supports, or other suitable hardware necessary to apply the bending stress through the specified bend angle.

  3. PROCEDURE

    Each flexible or semi-flexible lead to be tested shall be subjected to a 90° bend. Any number or all of the leads of the test device may be bent 90° simultaneously. Each lead shall be bent 90° in one direction in the same plane without lead restriction. Leads may be bent 90° by performing a lead form operation.

    1. Direction of bend

      Test leads shall be bent in the normal lead form configuration.

    2. Procedure for pre-formed leads

      When normally straight leads are supplied in a pre-formed condition, then this test condition shall not apply.

    3. Procedure for flexible and semi-flexible leads (e.g., flat packs and axial-lead metal-can devices)

      1. Flexible leads

        Flexible leads shall be bent in the middle of the lead through an arc of at least 90°, unless otherwise specified.

      2. Semi-flexible leads

        Semi-flexible leads shall be bent in the middle of the lead through an arc of at least 90°, unless otherwise specified.

    4. Failure criteria

      When examined using magnification between 10X and 20X after removal of the stress, any cracking of the lead plating which results in flaking, peeling or blistering or the crack can be peeled back with a sharp instrument (i.e. knife) shall be rejected.

  4. SUMMARY

    The following details shall be specified in the applicable acquisition document:

    1. Bending arc, if other than that specified.

    2. Procedure, if other than that specified.

    3. Number and selection of leads and procedure for identification, if other than that specified.

End of 2004.7

Previous page: Test condition D - Solder pad adhesion for leadless chip carrier and similar devices

How to test bonds?

Lead integrity

All XYZTEC bond testers can be used for lead integrity testing. The MIL standard on this page describes the procedure in technical language. Our lead integrity test type page illustrates the test conditions A, B1, B2, C1, C2 and D with real examples. Click here to go there.

MIL-STD-883 method 2004.7 consists of 9 pages:

  1. Lead integrity
  2. A - Tension
  3. A1 - Lead braze integrity
  4. B1 - Bending stress
  5. B2 - Lead fatigue
  6. C1 - Lead torque
  7. C2 - Stud torque
  8. D - Solder pad adhesion for leadless chip carrier and similar devices
  9. E - Lead plating integrity

Lid torque for glass-frit-sealed packages

For lid torque testing, MIL-STD 883 Method 2024.2 applies. Click here to go there.

We have converted the method into a readable HTML format, just like MIL-STD-883 method 2004.7 here.

Die shear

Die shear on LTCC
Die shear on LTCC

Die shear strength is the subject of MIL-STD-883 Method 2019.9. We also have a page on the test type, laying out the unique characteristics of XYZTEC's bond testers in relation to die shear.

Stud pull

The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested. For flip-chip pull-off tests MIL-STD-883 method 2031.1 applies.

Wire Pull

www.wirepull.how

Click here if you wish to learn everything there is to know about Wire Pull. The extensive how-to on Wire Pull consists of 12 paragraphs, 7 pages and 4 appendices.

Cold Bump Pull

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 12 paragraphs and 7 pages.


Test types

How to test bonds?

Lead integrity

All XYZTEC bond testers can be used for lead integrity testing. The MIL standard on this page describes the procedure in technical language. Our lead integrity test type page illustrates the test conditions A, B1, B2, C1, C2 and D with real examples. Click here to go there.

MIL-STD-883 method 2004.7 consists of 9 pages:

  1. Lead integrity
  2. A - Tension
  3. A1 - Lead braze integrity
  4. B1 - Bending stress
  5. B2 - Lead fatigue
  6. C1 - Lead torque
  7. C2 - Stud torque
  8. D - Solder pad adhesion for leadless chip carrier and similar devices
  9. E - Lead plating integrity

Lid torque for glass-frit-sealed packages

For lid torque testing, MIL-STD 883 Method 2024.2 applies. Click here to go there.

We have converted the method into a readable HTML format, just like MIL-STD-883 method 2004.7 here.

Die shear

Die shear on LTCC
Die shear on LTCC

Die shear strength is the subject of MIL-STD-883 Method 2019.9. We also have a page on the test type, laying out the unique characteristics of XYZTEC's bond testers in relation to die shear.

Stud pull

The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested. For flip-chip pull-off tests MIL-STD-883 method 2031.1 applies.

Wire Pull

www.wirepull.how

Click here if you wish to learn everything there is to know about Wire Pull. The extensive how-to on Wire Pull consists of 12 paragraphs, 7 pages and 4 appendices.

Cold Bump Pull

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 12 paragraphs and 7 pages.


Test types


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