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The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested.
The Condor Sigma can be provided with a micro dispenser that can dispense very small drops of glue (micro liter amounts) very accurately and is cured with UV light. Combined with a USB Tweezer and special tips that look like the inverse of a mushroom, a glass stud can be taken from a magazine fully automatically and placed with a predefined pressure on the surface with the glue.
Click here to read all about this solution.
There are many other approaches to stud pull; click here to visit our test type page.
Click here for more information about the Condor Sigma bond tester and its unique properties.
If you are looking to increase your knowledge about bond testing, consider attending a bond testing seminar.