How to test bonds » Wire Pull » failure modes

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12. Failure modes

MIL-STD-883 2011.9 lists 26 failure modes (which they call failure categories), depending on the type of sample. We list the most common failure modes for gold wire and aluminium wire below. We also refer to our grading library, where you can download result codes.

i. Gold wire

  • Mid span break
    • Bond strength unknown
    • Acceptability depends on measured force
  • Heat affected zone (HAZ) break
    • HAZ strength known
    • Acceptability depends on measured force
  • Heel break
    • Heel strength known
    • Acceptability depends on measured force
  • IMC/bond break
    • IMC/bond strength known
    • Acceptability depends on measured force
  • Pad crater
    • Pad strength known
    • Acceptability depends on measured force
    • Possibly bonder process problem
  • Wedge crater
    • Acceptability depends on measured force
    • Possibly bonder process problem
  • Wedge bond break
    • Wedge bond strength known
    • Acceptability depends on measured force
Gold wire pull failure modes overviewGold wire pull failure modes overview

ii. Aluminium wire

  • Mid span break
    • Bond strength unknown
    • Acceptability depends on measured force
  • Heel break
    • Heel strength known
    • Acceptability depends on measured force
  • Wedge break
    • Wedge bond strength known
    • Acceptability depends on measured force
  • Both wedge bonds break
    • Possibly weak bonds
  • Wedge crater
    • Acceptability depends on measured force
    • Possibly bonder process problem
  • Both wedge craters
    • Probably weak bonds
    • Possibly bonder process problem
Aluminium wire pull failure modes overviewAluminium wire pull failure modes overview

13. Appendices

This how-to has four appendices, namely:

  1. Force calculations
    1. Wire length l
    2. Position d1 from first bond angle θ
    3. Position d1 from second bond angle θ
    4. Angle at second bond Φ
    5. Pull at equal angles
  2. MIL-STD-883 2011.9 destructive
    1. Purpose
    2. Apparatus
    3. Procedure
    4. Summary
  3. MIL-STD-883 2023.7 non-destructive
    1. Purpose
    2. Apparatus
    3. Procedure
    4. Summary
  4. MIL-STD-883 2023.7 Appendix A

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How to test bonds?

Wire Pull:

www.wirepull.how

Thin wire gold pull test
Thin wire gold pull test
  1. Introduction
  2. What is wire pull?
  3. What kind of wires can be tested?
  4. Objectives
  5. Tool design
  6. Tool quality
    1. Material and damage
    2. Hook concentricity
  7. Alignment
    1. Quick manual testing of thin wire
    2. Auto hook
    3. DVS 2811
    4. Triangulation
    5. Automation and wire detect
  8. Loop height measurement
  9. Work holder and clamping
  10. Variants on wire pull
    1. Vector pull
    2. SMD gull wing leads
  11. Test method settings
    1. Test definition
    2. Statistical Process Control (SPC)
    3. Data analysis
    4. Data export
  12. Failure modes
    1. Gold wire
    2. Aluminium wire
  13. Appendices
    1. Force calculations
    2. MIL-STD-883 2011.9 destructive
    3. MIL-STD-883 2023.7 non-destructive
    4. MIL-STD-883 2023.7 Appendix A

Cold Bump Pull:

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 13 paragraphs and 7 pages.

Tweezer Pull:

www.tweezerpull.how

Click here if you wish to learn everything there is to know about Tweezer Pull. The extensive how-to on Tweezer Pull consists of 9 paragraphs and 6 pages.


Test types

How to test bonds?

Wire Pull:

www.wirepull.how

Thin wire gold pull test
Thin wire gold pull test
  1. Introduction
  2. What is wire pull?
  3. What kind of wires can be tested?
  4. Objectives
  5. Tool design
  6. Tool quality
    1. Material and damage
    2. Hook concentricity
  7. Alignment
    1. Quick manual testing of thin wire
    2. Auto hook
    3. DVS 2811
    4. Triangulation
    5. Automation and wire detect
  8. Loop height measurement
  9. Work holder and clamping
  10. Variants on wire pull
    1. Vector pull
    2. SMD gull wing leads
  11. Test method settings
    1. Test definition
    2. Statistical Process Control (SPC)
    3. Data analysis
    4. Data export
  12. Failure modes
    1. Gold wire
    2. Aluminium wire
  13. Appendices
    1. Force calculations
    2. MIL-STD-883 2011.9 destructive
    3. MIL-STD-883 2023.7 non-destructive
    4. MIL-STD-883 2023.7 Appendix A

Cold Bump Pull:

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 13 paragraphs and 7 pages.

Tweezer Pull:

www.tweezerpull.how

Click here if you wish to learn everything there is to know about Tweezer Pull. The extensive how-to on Tweezer Pull consists of 9 paragraphs and 6 pages.


Test types


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