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X-WR-CALNAME:Xyztec
X-ORIGINAL-URL:https://www.xyztec.com/ja/
X-WR-CALDESC:Xyztec のイベント
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TZID:UTC
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DTSTART:20250101T000000
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DTSTART:20260329T010000
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DTSTART:20261025T010000
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BEGIN:VEVENT
DTSTART;TZID=UTC:20260805T080000
DTEND;TZID=UTC:20260807T170000
DTSTAMP:20260731T093445Z
CREATED:20260730T092308Z
LAST-MODIFIED:20260731T093445Z
UID:75454-1785916800-1786122000@www.xyztec.com
SUMMARY:ICEPT
DESCRIPTION:ICEPT (China International Conference on Electronic Packaging Technology) has long been a representative academic and technical exchange platform in the global electronic packaging field and is also regarded as an important international event by the industry. This conference is expected to gather globally renowned wafer fabs\, OSAT packaging and testing plants\, advanced packaging supply chain\, and high-end equipment enterprises\, as well as multiple research institutes\, to jointly showcase the latest developments in 2.5D/3D packaging\, Chiplet integration\, interconnect technology\, and reliability testing.\n  \nIn the field of advanced packaging and microelectronic mechanics testing\, xyztec is well recognized in both the global and Chinese markets. Its push-pull testing equipment and automation technology continue to provide key support for the reliability verification of Chiplets and heterogeneous integrated components.\n  \nDuring ICEPT 2026\, xyztec will collaborate with its core agent in China\, ExTripod\, to publicly demonstrate its fully automatic push-pull force testing equipment. Live demonstrations will showcase high-precision automated testing capabilities for micro solder joint pull (Wire/Bump Pull) and chip push (Die Shear) applications\, assisting sealing and testing operators in improving reliability verification efficiency and process control accuracy.\n  \nYou are welcome to visit our booth and learn more about our latest bond testing solutions.
URL:https://www.xyztec.com/ja/event/icept/
LOCATION:Xi’an\, China\, Xi'an\, China
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260826T080000
DTEND;TZID=UTC:20260828T170000
DTSTAMP:20260730T095058Z
CREATED:20251221T060410Z
LAST-MODIFIED:20260730T095058Z
UID:74203-1787731200-1787936400@www.xyztec.com
SUMMARY:PCIM Asia
DESCRIPTION:PCIM Asia Shenzhen 2026\, as an annual event for power electronics\, smart sports\, and renewable energy management that has been deeply rooted in Asia for more than 20 years\, is the core link connecting the industry chain with cutting-edge scientific research achievements.\nThis exhibition focuses on high-value application areas such as SiC/GaN wide ban charged crystals\, power transistor components and modules\, automotive electronics/new energy vehicles\, and electrified transportation industry chains.\n  \nIn the field of power transistor and automotive grade device packaging and testing\, xyztec has always maintained a leading position in the global and Chinese markets with its powerful high thrust/high tensile testing technology\, ultra-high reproducibility accuracy\, and ultimate automation integration capabilities\, setting an industry benchmark for the packaging reliability of power modules.\n  \nAt the PCIM Asia Shenzhen 2026 site\, xyztec will collaborate with its important agent in China\, ExTripod\, to publicly showcase its flagship fully automatic push-pull force testing equipment.\nA dynamic demonstration will be conducted on site to demonstrate an efficient automated push-pull force testing solution for power modules\, including thick aluminum wire/copper strip tension\, as well as high-force die shear testing. The demonstration will highlight how these solutions effectively address the quality control challenges associated with high-power device manufacturing.\n  \nYou are welcome to visit our booth and learn more about our latest bond testing solutions.
URL:https://www.xyztec.com/ja/event/pcim-asia/
LOCATION:Shenzhen World Exhibition & Convention Center (Bao’an Venue)\, China\, Hall 16\, Shenzhen\, China
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260902T080000
DTEND;TZID=UTC:20260904T170000
DTSTAMP:20260730T084855Z
CREATED:20251221T060629Z
LAST-MODIFIED:20260730T084855Z
UID:74205-1788336000-1788541200@www.xyztec.com
SUMMARY:Semicon Taiwan 2026
DESCRIPTION:SEMICON Taiwan 2026 will be held at the Nangang Exhibition Center in Taipei in early September\, continuing to highlight its position as an important communication platform for the global semiconductor industry.\nThe exhibition gathers key links such as wafer manufacturing\, equipment\, materials\, advanced packaging\, and smart manufacturing\, and has become an important indicator for observing the global semiconductor supply chain layout\, technological upgrading\, and industrial cooperation.\n  \nThis year’s exhibition mainly focuses on smart manufacturing and advanced packaging\, and has established a special zone for wafer smart manufacturing for the first time\, showcasing cutting-edge applications such as automation\, robotics\, digital clones\, and industrial AI\, reflecting the continuous evolution of the industry towards high efficiency\, high integration\, and high precision.\n  \nxyztec has been deeply involved in wafer level and packaging testing applications\, with its main customer base covering top tier customers in semiconductor packaging\, wafer level packaging\, Chiplets\, and high-precision bond testing; In the field of automated testing in Taiwan\, xyztec has established a stable market reputation with its automated Bond Tester and integration capabilities.\n  \nAt Semicon Taiwan xyztec will publicly unveil its latest equipment: the Sigma Nano!\nThis model focuses on higher positioning accuracy\, more precise and stable shear height control\, and true corresponding micrometer packaging testing capabilities\, targeting the advanced packaging and high-density interconnect application market\, which is one of the highlights of this exhibition.\n  \nYou are welcome to visit booth K2176 on the first floor\, and booth N0868 on the fourth floor of the Nangang Exhibition Center.
URL:https://www.xyztec.com/ja/event/semicon-taiwan-2/
LOCATION:Taipei Nangang Exibithion Center\, No.1\, Jingmao 2nd Rd.\, Nangang District\, Taipei City 11568\, Taiwan\, Taipei City\, Taiwan
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260909T080000
DTEND;TZID=UTC:20260911T170000
DTSTAMP:20251221T060747Z
CREATED:20251221T060747Z
LAST-MODIFIED:20251221T060747Z
UID:74207-1788940800-1789146000@www.xyztec.com
SUMMARY:CIOE
DESCRIPTION:Shenzhen World Exhibition & Convention Center (Bao’an Venue)，China
URL:https://www.xyztec.com/ja/event/cioe/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260928T080000
DTEND;TZID=UTC:20261001T170000
DTSTAMP:20251212T172811Z
CREATED:20251212T172811Z
LAST-MODIFIED:20251212T172811Z
UID:74170-1790582400-1790874000@www.xyztec.com
SUMMARY:IMAPS Symposium
DESCRIPTION:Encore boston harbor\nBoston\, Massachusetts\, USA
URL:https://www.xyztec.com/ja/event/imaps-symposium/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Helsinki:20261006T080000
DTEND;TZID=Europe/Helsinki:20261008T170000
DTSTAMP:20260729T140144Z
CREATED:20260317T231112Z
LAST-MODIFIED:20260729T140144Z
UID:74234-1791273600-1791478800@www.xyztec.com
SUMMARY:Expo for Electronics Manufacturing (EFX) 2026
DESCRIPTION:
URL:https://www.xyztec.com/ja/event/expo-for-electronics-manufacturing/
LOCATION:Messe Stuttgart\, Stuttgart\, Germany
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20261013T080000
DTEND;TZID=UTC:20261015T170000
DTSTAMP:20251212T173742Z
CREATED:20251212T173742Z
LAST-MODIFIED:20251212T173742Z
UID:74174-1791878400-1792083600@www.xyztec.com
SUMMARY:Semicon West
DESCRIPTION:Moscone Center\, San Francisco\, California\, USA
URL:https://www.xyztec.com/ja/event/semicon-west/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20261026T080000
DTEND;TZID=UTC:20261028T170000
DTSTAMP:20251221T053726Z
CREATED:20251221T053726Z
LAST-MODIFIED:20251221T053726Z
UID:74184-1793001600-1793206800@www.xyztec.com
SUMMARY:PSECE\, 21TH Philippine Semiconductor & Electronics Convention and Exhibition
DESCRIPTION:SMX Convention Center Manila\, Pasay City\, Philippines
URL:https://www.xyztec.com/ja/event/psece-21th-philippine-semiconductor-electronics-convention-and-exhibition/
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