16 April 2019
The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with the new motto: "Solutions for electronic assemblies and systems". At our booth 4A/147 we will introduce you to interesting automated bond testing solutions for high forces, large working areas and lead frames.
The next millennium has begun. XYZTEC has developed a new test system capable of applying accurate shear, pull and push forces for automotive battery applications and applications requiring larger working area or higher forces up to 1000 kgf.
By combining our state of the art Sigma with an independent lead frame loader/un-loader, we can offer a hands-off fully automated bond test solution for testing all sizes of lead frames, cassettes, magazines, PCB’s, Flex and boat carriers.
Click here and send a short e-mail including your full name, telephone number and company name. You will receive the corresponding code from us to register for the SMTconnect free of charge.
We look forward to seeing you at our booth!
We are both delighted and disheartened to announce that XYZTEC's CTO Bob Sykes retires in April 2019. Since joining XYZTEC in 2009 Bob has made a major contribution in the company’s growth, with XYZTEC transcending from one of the important players in the bond testing market to its number one spot today, both in technology and worldwide annual sales. The Condor Sigma and several XYZTEC patents being among his major accomplishments.
His retirement is not really a goodbye. Bob will remain active for XYZTEC towards the future, but obviously less intensively. We wish Bob all the best in this next chapter of his life.
We are looking for an Electronic Engineer for our HQ in Panningen, The Netherlands. The job description below is in Dutch, as the job opening is for our Dutch office. However, good English capability is required.
Kun jij elektronische schakelingen ontwerpen? Ben jij breed inzetbaar voor het ontwikkelen en testen van meetmethodes voor grote spelers in de semiconductor industrie? Lijkt het je leuk de wereld over te reizen met ons salesteam om deze applicaties te demonstreren? Reageer dan nu op deze functie!
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.