{"id":63080,"date":"2020-06-18T06:34:41","date_gmt":"2020-06-18T06:34:41","guid":{"rendered":"https:\/\/www.xyztec.com\/docs\/cold-bump-pull-cbp\/"},"modified":"2023-09-26T11:35:10","modified_gmt":"2023-09-26T11:35:10","slug":"cold-bump-pull-cbp","status":"publish","type":"docs","link":"https:\/\/www.xyztec.com\/ja\/knowledgecenter\/pull-tests-ja-2\/cold-bump-pull-cbp\/","title":{"rendered":"Cold bump pull (CBP)"},"content":{"rendered":"<h2>Cold Bump Pull (CBP)<\/h2>\n<p>CBP stands for Cold Bump Pull or Cold Ball Pull.\u00a0To grip a ball we have to reform it to the shape something like a mushroom. This is done with special tweezer jaws that have cavities that reform the ball when they close.\u00a0If we get a higher test force by \u201cover gripping\u201d the ball so that the reforming cuts over the bond this is better than a lower force with a ductile or extrusion where the bond was still not tested but at a lower force.<\/p>\n<p><!--more--><\/p>\n<p>Ideally, the \u201cstem\u201d of the mushroom shape is the larger or the same diameter as the bond but if over gripping tests the bond at a higher force, it is a better test. We might still get a ductile or extrusion when we over grip, but the bond has been tested to the highest force possible.<\/p>\n<p><img fetchpriority=\"high\" decoding=\"async\" class=\"alignnone wp-image-15947 size-full\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Cold-Bump-Pull-1.jpg\" alt=\"Cold Bump Pull\" width=\"1042\" height=\"441\" \/><\/p>\n<h3>Control the gripping force<\/h3>\n<p><span data-preserver-spaces=\"true\">Cold bump pull testing with the xyztec <\/span><a class=\"_e75a791d-denali-editor-page-rtfLink\" href=\"https:\/\/www.xyztec.com\/features\/tools-tweezer-micro-grippers\/\" target=\"_blank\" rel=\"noopener noreferrer\"><span data-preserver-spaces=\"true\">USB Tweezers<\/span><\/a><span data-preserver-spaces=\"true\">\u00a0provides unparalleled precision and control. The bond of many solder balls is at the bottom of a cavity formed by the solder resist layer. In a shear test, this supports the bond, resulting in a predominance of solder shear failure modes.<\/span><\/p>\n<p><span data-preserver-spaces=\"true\">In a pull test, the bond is not supported in this fashion, leading to more relevant failure modes. Special jaws are required to grip the ball. This reform the upper part of the ball to enable the pull load to be applied without disturbing the bond.\u00a0<\/span><\/p>\n<p><img decoding=\"async\" class=\"alignnone wp-image-15971 size-full\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/CBP-vs-Shear.png\" alt=\"CBP vs Shear\" width=\"362\" height=\"361\" \/><\/p>\n<h2>How to: Cold Bump Pull<\/h2>\n<p>We aim to spread knowledge about bond testing in the industry. That is why we have an\u00a0<a href=\"https:\/\/www.xyztec.com\/how-to-wire-pull-wp\/\">extensive &#8220;how-to&#8221; on <\/a>Cold Bump Pull (CBP) on our website.<\/p>\n<h3>Cold Bump Pull (CBP) test 80\u00b5m cavity by force controlled USB Tweezers<\/h3>\n<div style=\"width: 640px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-63080-1\" width=\"640\" height=\"360\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/xyztecvideos.b-cdn.net\/Cold%20Bump%20Pull%20(CBP)%2080\u00b5m%20cavity%20by%20force%20controlled%20USB%20Tweezers.mp4?_=1\" \/><a href=\"https:\/\/xyztecvideos.b-cdn.net\/Cold%20Bump%20Pull%20(CBP)%2080\u00b5m%20cavity%20by%20force%20controlled%20USB%20Tweezers.mp4\">https:\/\/xyztecvideos.b-cdn.net\/Cold%20Bump%20Pull%20(CBP)%2080\u00b5m%20cavity%20by%20force%20controlled%20USB%20Tweezers.mp4<\/a><\/video><\/div>\n<h2>Standards<\/h2>\n<ul class=\"bulletimg\">\n<li>JEDEC JESD22-B115<\/li>\n<li>JEITA EIAJ ET-7407<\/li>\n<li>IPC-9708<\/li>\n<\/ul>\n<h2>Test features<\/h2>\n<ul class=\"bulletimg\">\n<li>Sensor accuracy \u00b10.075%<\/li>\n<li>Produces failure modes of interest like IMC bond failure and Pad Crater<\/li>\n<li>Reproduces pull loads that typically occur in most real failure events<\/li>\n<li>Test ball geometries down to 50\u00b5m diameter (dependent on ball height to diameter ratio)<\/li>\n<li><a href=\"https:\/\/www.xyztec.com\/copper-pillar-testing\/\">Copper pillar testing also possible<\/a><\/li>\n<\/ul>\n<h2>Tweezer features<\/h2>\n<ul class=\"bulletimg\">\n<li>Control the gripping force<\/li>\n<li>Programmable and traceable opening position and closing force<\/li>\n<li>Programmable landing force<\/li>\n<li>Programmable force maintain<\/li>\n<\/ul>\n<h2>CBP Jaw Cleaner<\/h2>\n<p>During use, solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily.<\/p>\n<p><img decoding=\"async\" class=\"alignnone wp-image-15978 size-full\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Cavity_clean_contamination.png\" alt=\"Cavity cleanCavity clean contaminationcontamination\" width=\"398\" height=\"350\" \/><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Cold Bump Pull (CBP) CBP stand [&hellip;]<\/p>\n","protected":false},"author":18,"featured_media":57645,"parent":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-63080","docs","type-docs","status-publish","has-post-thumbnail","hentry","doc_tag-cold-bump-pull-cbp-ja-2","doc_tag-pull-ja-2","doc_category-pull-tests-ja-2"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>CBP stands for Cold Bump Pull or Cold Ball Pull test<\/title>\n<meta name=\"description\" content=\"To grip a ball we have to reform it to the shape something like a mushroom. 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