{"id":63224,"date":"2020-07-02T10:59:08","date_gmt":"2020-07-02T10:59:08","guid":{"rendered":"https:\/\/www.xyztec.com\/docs\/copper-pillar-shear\/"},"modified":"2023-12-21T13:31:11","modified_gmt":"2023-12-21T13:31:11","slug":"copper-pillar-shear","status":"publish","type":"docs","link":"https:\/\/www.xyztec.com\/ja\/knowledgecenter\/shear-tests-ja\/copper-pillar-shear\/","title":{"rendered":"Copper pillar shear"},"content":{"rendered":"<h2>Copper pillar shear<\/h2>\n<p>Copper pillar is rapidly being adopted as a bumped wafer interconnect. The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.<\/p>\n<p>As with any interconnect the quality of the bonding process between the different parts is vital for the reliability of the finished product. The bond between the copper and its pad on the wafer are of particular interest as this is seen as the most likely failure mode. In a bond test a failure mode between the copper and wafer is then the \u201cfailure mode of interest\u201d.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-16105\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png\" alt=\"Copper Pillar\" width=\"203\" height=\"124\" \/><img decoding=\"async\" class=\"alignnone size-full wp-image-16077\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_friction_grip.png\" alt=\"Friction grip\" width=\"126\" height=\"126\" \/> <img decoding=\"async\" class=\"alignnone size-full wp-image-16070\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Reformed_solder_ball.png\" alt=\"Reformed_solder_ball\" width=\"142\" height=\"126\" \/><\/p>\n<p><!--more--><\/p>\n<h2>Test features<\/h2>\n<ul class=\"bulletimg\">\n<li>Sensor accuracy \u00b10.075%<\/li>\n<li>Down to 35\u00b5m diameter copper pillars<\/li>\n<\/ul>\n<h2>Copper to pad interconnect<\/h2>\n<h3>Shear testing<\/h3>\n<p>An alternative to pull testing is a shear test. If this is done with a very low shear height the bond is subjected to mostly shear. If a high shear height is used the bond is loaded by shear and a bending moment. It is though the bending loads, and in particular the tension side of the bending moment, that typically cause the bond to fail. The pillar tends to pivot on its edge furthest from the shear tool, making the failure mode very similar to that of a pull test.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16042\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_low_shear.png\" alt=\"Copper_Pillar_low_shear\" width=\"266\" height=\"106\" \/> <img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16035\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_high_shear.png\" alt=\"Copper_Pillar_high_shear\" width=\"266\" height=\"121\" \/><\/p>\n<p>The advantages of a high shear test are that the tool and test are much simpler. Making pull tweezers with 50\u00b5m cavities is difficult and costly. Aligning them to the pillar takes time and requires skill. A shear test is no different to that commonly used when testing wire bonds. The only difference being the shear height is bigger. The tools cost a lot less and its alignment to the pillar is not so critical, making it less skilled and faster.<\/p>\n<p>Variations in shear height will cause variations in the test result but with the <a href=\"https:\/\/www.xyztec.com\/ja\/%e8%a3%bd%e5%93%81\/sigma\/\">Sigma<\/a>\u00a0accuracy of \u00b11\u00b5m these affects are likely to be less than those caused by the grip reforming and operator misalignment in a pull test. It is though beneficial to test with the highest possible shear height as this reduces any effect from the small variations in height and assures that the bending moment dominates the failure mode.<\/p>\n<p>For a solder ball a\u00a0<a href=\"https:\/\/www.xyztec.com\/how-to-cold-bump-pull\/cold-bump-pull-cbp\/\">Cold Bump Pull test<\/a>\u00a0is known to be better than shear. A 1st bond Gold ball test is best done with a low shear height. The reason for both of these comes from our \u201c<a href=\"https:\/\/www.xyztec.com\/about\/seminars\/\">Golden rules of bond testing<\/a>\u201d \u00a9, they both produce the highest number of failure modes of interest or the highest possible test force.<\/p>\n<p>In the case of Copper pillars we should be guided by these same rules. Shear is the simplest test and it does produce the failure mode of interest. The optimum shear height will be the one that maximizes this or produces the highest test force.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16021\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_failure_mode_S1.png\" alt=\"Copper Pillar failure mode S1\" width=\"173\" height=\"270\" \/> <img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-16028\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_sheartest-250x300.png\" alt=\"Copper_Pillar_sheartest\" width=\"250\" height=\"300\" \/><\/p>\n<h2>Solder to copper interconnect<\/h2>\n<h3>Shear testing<\/h3>\n<p>As with any shear test, testing the solder to copper interconnect requires accurate alignment of the shear tool to the bond line. When the height of the bond line from the substrate varies due to tolerance build up conventional shear height methods can be a problem.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-16091 size-full\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper-pillar-low-high-shear-height-1.png\" alt=\"Copper-pillar-low-high-shear-height\" width=\"618\" height=\"205\" \/><\/p>\n<p>A solution is xyztec&#8217;s unique top landing shear method. The tool lands on the top of the solder, then moves back and down programmable amounts to guarantee a shear height relative to the top of the pillar rather than its base.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16084\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/copper-pillar-top-landing-test-sequence.png\" alt=\"copper-pillar-top-landing-test-sequence\" width=\"618\" height=\"493\" \/><\/p>\n<h3>Copper pillar copper interconnect shear height control<\/h3>\n<div style=\"width: 640px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-63224-1\" width=\"640\" height=\"360\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/xyztecvideos.b-cdn.net\/Copper%20pillar%20copper%20interconnect%20shear%20height%20control.mp4?_=1\" \/><a href=\"https:\/\/xyztecvideos.b-cdn.net\/Copper%20pillar%20copper%20interconnect%20shear%20height%20control.mp4\">https:\/\/xyztecvideos.b-cdn.net\/Copper%20pillar%20copper%20interconnect%20shear%20height%20control.mp4<\/a><\/video><\/div>\n<h2>Choose between pull and shear testing<\/h2>\n<p>The choice between pull or shear testing depends on the application and the test objectives. Xyztec has a lot of experience with different types of copper pillar products and can advise you on how to test in order to get the best information for your quality assurance process. If you are interested to find out more please <a href=\"https:\/\/www.xyztec.com\/about\/contact\/\">contact us<\/a>\u00a0for more information, to request an application report, a demonstration or a quotation.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Copper pillar shear Copper pil [&hellip;]<\/p>\n","protected":false},"author":18,"featured_media":61264,"parent":0,"comment_status":"open","ping_status":"open","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-63224","docs","type-docs","status-publish","has-post-thumbnail","hentry","doc_category-shear-tests-ja"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Copper pillar is rapidly being adopted as a bumped wafer interconnect.<\/title>\n<meta name=\"description\" content=\"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.\" 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