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METHOD:PUBLISH
X-WR-CALNAME:Xyztec
X-ORIGINAL-URL:https://www.xyztec.com/ja/
X-WR-CALDESC:Xyztec のイベント
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BEGIN:VTIMEZONE
TZID:UTC
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TZOFFSETFROM:+0000
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DTSTART:20230101T000000
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20240319
DTEND;VALUE=DATE:20240322
DTSTAMP:20260405T015713
CREATED:20240111T150122Z
LAST-MODIFIED:20240111T150245Z
UID:71976-1710806400-1711065599@www.xyztec.com
SUMMARY:IMAPS Scottsdale
DESCRIPTION:Device Packaging\nThe 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center\, from March 18-21\, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). \nDPC 2024 will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22). \nThe conference is a major forum for the exchange of knowledge and provides numerous technical\, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists\, process engineers\, product engineers\, manufacturing engineers\, professors\, students\, business managers\, and sales & marketing professionals.
URL:https://www.xyztec.com/ja/event/imaps-scotsdale/
LOCATION:WeKoPa
CATEGORIES:Trade Fair
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