Pull tests

Test types

Upwards (Z-axis)

Pull

A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).

Pull
Pull hook

Applications

  • Cross sectional shape of thin and thick wires
  • Small geometry (ultra fine pitch)
  • Ribbons either round or rectangular

Tools

  • Standard 90° hooks
  • Customized hooks

Pull test types

Click the play button to see a pull test type video or read more by clicking on the link below.

Проиграть видео
Проиграть видео
Проиграть видео
Проиграть видео

SMD component pull

Проиграть видео
Проиграть видео
Проиграть видео
Проиграть видео

Связаться с нами

Dirk Schade