Home » KnowledgeCenter » Guidelines » MIL-STD-883 method 2004.7 – Lead integrity » MIL-STD-883 method 2004.7 – Test condition D: Solder pad adhesion for leadless chip carrier and similar devices
This test is designed to check the capabilities of the device solder pads to withstand a delamination (peel) stress of specified tension and time.
Equipment for 10X magnification, suitable clamps and fixtures for securing the device and applying the specified tension/time conditions to wires soldered to the device solder pads. Equivalent linear pull test equipment may be used.
Unless otherwise specified, a delamination (peel) stress test shall be applied to randomly selected solder pads from each device selected for test. Further, unless otherwise specified, the sampling shall be Sample Size Number = 15, c = 0 based on the number of solder pads tested, chosen from a minimum of three devices. Preparation and testing of devices shall be in accordance with figure 2004-2 of this method and as follows.
When examined, using 10X magnification, after removal of the tension stress, the appearance of any delamination involving constituent solder pad interfaces shall be considered an adhesion failure of the solder pad. Separation of the solder pad from the device is an obvious (without visual magnification) adhesion failure. Separation of the wire from the solder fillet (leaving the solder pad intact) or wire breakage is considered a test procedure failure.
The following details shall be specified in the applicable acquisition document:
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