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Substrate materials are the foundation of all electronics packaging.
Our systems can provide mechanical testing of any substrate of interest to ensure material performance post-assembly.Substrates represent a wide range of materials and include rigid and flexible polymers, metals, ceramics, and even wearable materials in printed electronics and advanced wearable devices. In many cases, substrate performance may be of interest. A Sigma bond tester generates mechanical bend testing on substrates and devices to measure substrate performance as a function of repeated mechanical loading over time.
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J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
33 South Main St. Unit #1
PO box 2189
Wolfeboro, NH 03894
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.