31 July 2017
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
The first difficulty is the reduction in test load area to bond area as the die becomes thinner. This is especially problematic when shear testing, because there is less area to apply the test load to. As the die thickness reduces there comes a point when the test load stress between the tool and the die reaches its yield value before the bond reaches its yield stress. The die then fails before the bond and the bond strength is not measured.
The second difficulty relates to both shear and stud pull testing, namely the fact that die and substrate warpage with thin die are likely to occur. When shear testing, warped die and substrate increase buckling loads on the die that can cause it to fracture before the bond fails. For stud pull, warpage makes a strong and consistent glue layer thickness between the stud and die difficult.
To obtain the failure mode of interest i.e. a bond failure, we must be able to load the bond to the highest force possible. XYZTEC has achieved positive results by combining several techniques to significantly increase the maximum loads possible. The picture shows our patented 45° self aligning top landing tool.
Flip chip and soldered die applications have been successfully sheared, applying up to 1200MPa on the side edge of die.
XYZTEC is market leader in bond testing. We continue to develop solutions for all types of industries including solar, space, military, medical, automotive, interconnect and material science. Our customers include market leaders in all of these industries throughout the world. Owning the best quality assurance tells your customers what you priorities are. Request a live demonstration of the Condor Sigma on your sample and contact us today!
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
|May 2015||USB Tweezers|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.