Successful ESTC Conference in Dresden, Germany

20 September 2018

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. XYZTEC, technology leader in bond testing, was present to discuss and share information about fully automated bond testing.

This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

Newsletters

Dec 2018 The Science of Bond Testing
Aug 2018 Is Fully Automatic Bond Testing Possible?
Jul 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
Mar 2017 Fracture strength of thin wafers and die
Feb 2017 Centralized database for enhanced security and SPC options
Jan 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
Dec 2016 Coating and film testing
Nov 2016 Latest software release enables automatic grading
Oct 2016 Vision enhanced materials testing
Sep 2016 XYZTEC makes lid pull easy
Aug 2016 Condor Sigma W12 with large heater stage

 
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20 Sep Successful ESTC Conference in Dresden, Germany
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