Successful ESTC Conference in Dresden, Germany

20 September 2018

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. XYZTEC, technology leader in bond testing, was present to discuss and share information about fully automated bond testing.

This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

Newsletters

Aug 2018 Is Fully Automatic Bond Testing Possible?
Jul 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
Mar 2017 Fracture strength of thin wafers and die
Feb 2017 Centralized database for enhanced security and SPC options
Jan 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
Dec 2016 Coating and film testing
Nov 2016 Latest software release enables automatic grading
Oct 2016 Vision enhanced materials testing
Sep 2016 XYZTEC makes lid pull easy
Aug 2016 Condor Sigma W12 with large heater stage
Jul 2016 How to: Wire Pull

 
Click to subscribe.

Other news

21 Nov Presentation at CSPT 2018
15 Nov Matelec show 2018 for the Electrical and Electronics Industry with Antycip
20 Sep Successful ESTC Conference in Dresden, Germany
11 Jul LEGO® for Nepal sponsored by XYZTEC
05 Jun Visit us at SMT Hybrid Packaging Nuremberg
20 Apr Smart LED and Solar panels for XYZTEC head office
18 Apr XYZTEC workshop at IMAPS UK
16 Mar ODEOM shows Condor Sigma in Istanbul
15 Mar Semicon China under way
31 Jan Condor Sigma W12 at Semicon Korea
04 Dec Condor Sigma stars in Audi Tech Day video
10 Nov Raysun to represent XYZTEC in China
23 Oct Award for First Technology China
19 Jul XYZTEC granted subsidy for further accuracy improvements
23 Jun Presentation at CSPT 2017 by Bob Sykes
06 Jun Condor Sigma in São Paulo, Brazil
16 May Fully automatic lead frame tester introduced at SMT Hybrid Packaging
28 Apr Semicon Penang 2017 successful
28 Apr Pizza and Go cart racing at K1 Speed in Northern CA
14 Mar Visit us at Semicon China
16 Feb Job opening for Junior Mechanical Design Engineer [closed]
29 Nov Successful seminar in Russia with Sovtest
31 Oct Market leading Condor Sigma bond tester at TPCA Taiwan
08 Sep Automation features draw attention at Semicon Taiwan 2016
28 Jun HTMG represents XYZTEC in South America


View all news

Subscribe to our RSS-feed to be notified of the latest news automatically. You can also find us on Facebook, LinkedIn, Twitter, Weibo 微博, Google+, YouKu 优酷 and YouTube.

XYZTEC Newsletter
Newsletter

XYZTEC Newsletter

Subscribe

Your name:

Your email:


© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Home
News
Condor Sigma
Condor 150HF
Test types
Markets & solutions
Sales & support
Downloads
Events
Shop

XYZTEC Netherlands

J.F. Kennedylaan 14-B
5981 XC Panningen
Netherlands (map / route)
Tel: +31-77-3060920
Fax: +31-77-3060919

Find your local representative

XYZTEC Germany

Schäferei 18
06237 Leuna
OT Günthersdorf
Germany (map / route)
Tel: +49-34638-666690
Fax: +49-34638-666695
Cell: +49-172-3272991
Email: Dirk Schade

Find other office locations

Technology leader in bond testing worldwide