14 June 2011
A leading LED (Light Emitting Diode) manufacturer approached XYZTEC with an interesting challenge. They wanted to integrate 100% gold ball shear testing in their production lines of 2 and 4 inch LED wafers, while reducing labor costs. It was also required to interface with their software infrastructure to merge the production lot data with measurement results. Of course, the highest possible accuracy, repeatability and traceability were of utmost importance. Their previous bondtester supplier could not provide a solution.
In close collaboration with the customer, XYZTEC developed a unique automation integrated solution, based on the standard Condor 100 platform. A sophisticated customized workholder makes it easy for the operator to vacuum clamp the wafer on the tester, while providing high reproducible positioning accuracy, required for the full automation. Once the wafer is in place, the operator will scan the product identification barcode and the software automation macro is activated.
Within 3 minutes, 30 selected bonds on the wafer are shear tested without intervention by the operator. The software carries out an extensive routine, selecting the correct sensors on the RMU and driving to the precise positions to do shear tests. To prevent gold wire residue from obstructing the tool, a special designed air nozzle with minimum air flow directs the gold wire residue into a collecting box.
During automatic testing, the operator may watch the machine from a distance, as the camera image, which is shown on a second monitor, provides a clear visual image during testing. This eliminates the need for similar periodic inspection through a microscope enabling multiple machines to be easily and efficiently overseen from a distance. At the end of the procedure, or in case of a problem, the operator is alerted by a clear visual signal on the screen (for example orange to for operator input, red for failures).
The Condor system is configured in such a way that a camera takes a picture of each test which is outside a predefined range and stores it on the central database server for further, off-line investigations. As the images are relationally linked to the database, full traceability is offered to its measurement data. All data import and export functions are automatically running in the background and cannot be influenced by the operator.
Today, no less than eight Condor 100's are running day and night at this customer facility. The fact that all testing is carried out automatically minimizes operator influence and produces stable and constant measurement results. "Training time for new employees to learn to work with the XYZTEC bondtester is minimal", says the quality control manager.
The choice for XYZTEC was simple, when the previous bondtester supplier turned out not to be capable of fulfilling all requirements.
XYZTEC's local sales and support team in Taiwan stepped in and created a working solution within two months, making the bridge between the customer and the headquarters R&D team of XYZTEC in The Netherlands. "The XYZTEC experts were very responsive throughout the project and exceeded all our expectations. A huge difference with our previous supplier!", says the quality control manager.
The total savings on labor costs alone when choosing for the XYZTEC fully automated wafer testing solution can amount to 1,600,000 RMB or 240,000 USD per year, as the following table shows:
|Machines||6 sets||6 sets|
|Operators||6 people||1 person|
|Four shifts||24 people||4 people|
|Overall labor cost (China)||24 x 80k RMB = 1,920,000 RMB|
24 x 12k USD = 288,000 USD
|4 x 80k RMB = 320,000 RMB|
4 x 12k USD = 48,000 USD
|Jul 2019||Meet the world’s biggest bond testers|
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|18 Sep||Sigma and Magazine Loader in action at Semicon Taiwan|
|17 Sep||Xyztec at EMPC conference in Pisa|
|04 Sep||Meet us worldwide in September|
|05 Jul||Teaming up with Micronnect B.V. and BRIDGE S.r.l.|
|07 May||Newest Sigma HF High Force bond tester live in action at SMTconnect|
|26 Apr||XYZTEC spreads bond testing knowledge to partners worldwide|
|20 Mar||Visit us at Semicon China|
|29 Jan||XYZTEC at Semicon Korea|
|21 Nov||Presentation at CSPT 2018|
|15 Nov||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
|20 Sep||Successful ESTC Conference in Dresden, Germany|
|11 Jul||LEGO® for Nepal sponsored by XYZTEC|
|05 Jun||Visit us at SMT Hybrid Packaging Nuremberg|
|20 Apr||Smart LED and Solar panels for XYZTEC head office|
|18 Apr||XYZTEC workshop at IMAPS UK|
|16 Mar||ODEOM shows Condor Sigma in Istanbul|
|15 Mar||Semicon China under way|
|31 Jan||Condor Sigma W12 at Semicon Korea|
|04 Dec||Condor Sigma stars in Audi Tech Day video|
|10 Nov||Raysun to represent XYZTEC in China|
|23 Oct||Award for First Technology China|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
|23 Jun||Presentation at CSPT 2017 by Bob Sykes|
|06 Jun||Condor Sigma in São Paulo, Brazil|
|16 May||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|