15 November 2011
Today before a sizeable audience at Productronica in Munich Germany, XYZTEC launched the Condor Sigma.
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma is the best choice featuring unparalleled 0.075% accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership.
This system is designed to be compatible with the most commonly used work holders and tooling, that you may already have in stock. The compatibility modes ensure consistency in your measurement results across machines. Equipped with the most powerful intuitive software, operators can quickly learn to use the Condor Sigma alongside your existing equipment and procedures.
XYZTEC is well known for many innovative bond testing solutions. The Revolving Measurement Unit (RMU) is one of the results of XYZTEC engineering team utilizing customer feedback.
Now the capability of the RMU achieves up to 200 kgf shear and 100 kgf pull and push. The flexible configuration allows 1 to 6 sensors enabling fully automatic and manual testing. Compared to changing cartridges manually, the RMU eliminates warm up time and greatly reduces the risk of sensor damage.
The standard configuration contains a perpendicular automation camera at a small offset from the test point with a choice of two magnifications and optical resolutions down to 1.5 μm.
The Condor Sigma can be equipped with a maximum of three separate cameras mounted in different positions to offer the best range of imaging possibilities. For automation, fiducial mark recognition is available.
A wide variety of tests is possible using the Condor Sigma with forces ranging from less than 1 gf to 200 kgf. Digital temperature correction and the world’s highest resolution of 24 bits contribute to the most reliable and repeatable measurement results.
The shear landing force is programmable to a minimum of a few grams. Even on a higher speed a soft landing is possible. Featuring 50 mm/s the X, Y & Z axes are very quick and power up in any position.
The open frame design and large stroke for all three stages offer the capability to handle the widest range of sample sizes with little or no special tooling. High accuracy quick release work holders and measurement units ensure rapid sample loading and production setup.
With 10+ years in house experience, XYZTEC takes bond testing to a new level with the Condor Sigma. It uses the best of established technology together with innovation to set the new standard. Its broad specifications ensure it has the capability to perform all commonly used industry tests as well as special and challenging applications.
Current users of bond test equipment will find that the Condor Sigma system will provide an easy transition from their existing process to the state of the art Condor Sigma platform. Performance is without a doubt best in class, but do not take our word for it. Try it for yourself, and put it to the test!
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
|23 Jun||Presentation at CSPT 2017 by Bob Sykes|
|06 Jun||Condor Sigma in São Paulo, Brazil|
|16 May||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|28 Apr||Semicon Penang 2017 successful|
|28 Apr||Pizza and Go cart racing at K1 Speed in Northern CA|
|14 Mar||Visit us at Semicon China|
|16 Feb||Job opening for Junior Mechanical Design Engineer [closed]|
|29 Nov||Successful seminar in Russia with Sovtest|
|31 Oct||Market leading Condor Sigma bond tester at TPCA Taiwan|
|08 Sep||Automation features draw attention at Semicon Taiwan 2016|
|28 Jun||HTMG represents XYZTEC in South America|
|14 Jun||Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT) [UPDATED]|
|14 Jun||Purchase wire hooks, shear tools, tweezer tips by PayPal|
|03 May||SMT 2016 all about automation|
|11 Apr||Annual sales and service event in Bangkok big success|
|15 Mar||Come visit us at Semicon China|
|04 Mar||HiSOL new distributor in Japan|
|01 Mar||Cellphone display LCD driver IC testing|
|13 Nov||ISO-Dynamique and Axend represent XYZTEC in Malaysia, Singapore, Thailand, Indonesia and Vietnam|
|12 Nov||Wire detect functionality popular at Productronica|
|30 Oct||How to: Cold Bump Pull|
|07 Sep||Condor Sigma draws attention at Semicon Taiwan|
|03 Jul||Exciting sales and service meeting in Bangkok|
|01 Jul||Bond Test Measurement Accuracy|