Successful seminar at Tianjin University on Packaging High-temperature Electronics
8 December 2011
The conference was visited by more than 80 people from leading companies in China
XYZTEC looks back on a very successful seminar together with Tianjin University on “Challenges and Opportunities in Packaging High-temperature Electronics”.
This conference was visited by more than 80 people from leading companies in China, sharing knowledge. On behalf of co-host XYZTEC, Dirk Schade presented information about the latest possibilities in high force IGBT application testing.
XYZTEC looks back on a very successful seminar together with Tianjin University
Different users from different countries met and were excited to discuss new manufacturing and testing techniques. Among the other speakers on the event were Professor Guo-quan Lu from Tianjin University and representatives from Orthodyne Electronics.
Professor Guo-quan Lu and Dirk Schade
The Sinter technology and Cu wire bonding attracted a lot of attention. The visitors of the seminar used the breaks between the various sessions for sharing experience.
Newsletters
Other news
Subscribe to our RSS-feed to be notified of the latest news automatically. You can also find us on Facebook, LinkedIn, Twitter, Weibo 微博, Google+, YouKu 优酷 and YouTube.
