22 April 2013
With Condor Sigma Lite XYZTEC gives you a low cost entry point without sacrificing performance to meet future demands. The Condor Sigma Lite is upgradeable to the specifications of the regular Condor Sigma and beyond. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma platform is the best choice featuring unparalleled accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership.
This system is designed to be compatible with the most commonly used work holders and tooling, that you may already have in stock. The compatibility modes ensure consistency in your measurement results across machines. Equipped with the most powerful intuitive software, operators can quickly learn to use the Condor Sigma Lite alongside your existing equipment and procedures.
The Revolving Measurement Unit (RMU) with 6 sensor positions eliminates warm up time and greatly reduces the risk of sensor damage. The standard configuration is max. 100 kgf shear and 10 kgf pull and push, but it can be upgraded to 200 kgf shear and 100 kgf pull and push. This flexibility allows the bond tester to expand with your growing business.
All sensor modules are interchangeable and fit any single heads and the Revolving Measurement Unit. Fully calibrated and tested, each sensor module can be removed and replaced within a few minutes. Our calibration is also compatible with calibration sets from other suppliers.
The open frame design and the same stroke for all three stages offer the capability to handle different sample sizes with little or no special tooling. High accuracy quick release work holders and measurement units ensure rapid sample loading and production setup.
Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.
|Dec 2019||Xyztec faces any challenge|
|Jul 2019||Meet the world’s biggest bond testers|
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|17 Jan||Visit us in Tokyo this month|
|13 Nov||Visit us at Productronica in München|
|03 Oct||Xyztec at EuWoRel Berlin|
|18 Sep||Sigma and Magazine Loader in action at Semicon Taiwan|
|17 Sep||Xyztec at EMPC conference in Pisa|
|04 Sep||Meet us worldwide in September|
|05 Jul||Teaming up with Micronnect B.V. and BRIDGE S.r.l.|
|07 May||Newest Sigma HF High Force bond tester live in action at SMTconnect|
|26 Apr||XYZTEC spreads bond testing knowledge to partners worldwide|
|20 Mar||Visit us at Semicon China|
|29 Jan||XYZTEC at Semicon Korea|
|21 Nov||Presentation at CSPT 2018|
|15 Nov||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
|20 Sep||Successful ESTC Conference in Dresden, Germany|
|11 Jul||LEGO® for Nepal sponsored by XYZTEC|
|05 Jun||Visit us at SMT Hybrid Packaging Nuremberg|
|20 Apr||Smart LED and Solar panels for XYZTEC head office|
|18 Apr||XYZTEC workshop at IMAPS UK|
|16 Mar||ODEOM shows Condor Sigma in Istanbul|
|15 Mar||Semicon China under way|
|31 Jan||Condor Sigma W12 at Semicon Korea|
|04 Dec||Condor Sigma stars in Audi Tech Day video|
|10 Nov||Raysun to represent XYZTEC in China|
|23 Oct||Award for First Technology China|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|