22 April 2013
With Condor Sigma Lite XYZTEC gives you a low cost entry point without sacrificing performance to meet future demands. The Condor Sigma Lite is upgradeable to the specifications of the regular Condor Sigma and beyond. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma platform is the best choice featuring unparalleled accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership.
This system is designed to be compatible with the most commonly used work holders and tooling, that you may already have in stock. The compatibility modes ensure consistency in your measurement results across machines. Equipped with the most powerful intuitive software, operators can quickly learn to use the Condor Sigma Lite alongside your existing equipment and procedures.
The Revolving Measurement Unit (RMU) with 6 sensor positions eliminates warm up time and greatly reduces the risk of sensor damage. The standard configuration is max. 100 kgf shear and 10 kgf pull and push, but it can be upgraded to 200 kgf shear and 100 kgf pull and push. This flexibility allows the bond tester to expand with your growing business.
All sensor modules are interchangeable and fit any single heads and the Revolving Measurement Unit. Fully calibrated and tested, each sensor module can be removed and replaced within a few minutes. Our calibration is also compatible with calibration sets from other suppliers.
The open frame design and the same stroke for all three stages offer the capability to handle different sample sizes with little or no special tooling. High accuracy quick release work holders and measurement units ensure rapid sample loading and production setup.
Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
|23 Jun||Presentation at CSPT 2017 by Bob Sykes|
|06 Jun||Condor Sigma in São Paulo, Brazil|
|16 May||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|28 Apr||Semicon Penang 2017 successful|
|28 Apr||Pizza and Go cart racing at K1 Speed in Northern CA|
|14 Mar||Visit us at Semicon China|
|16 Feb||Job opening for Junior Mechanical Design Engineer [closed]|
|29 Nov||Successful seminar in Russia with Sovtest|
|31 Oct||Market leading Condor Sigma bond tester at TPCA Taiwan|
|08 Sep||Automation features draw attention at Semicon Taiwan 2016|
|28 Jun||HTMG represents XYZTEC in South America|
|14 Jun||Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT) [UPDATED]|
|14 Jun||Purchase wire hooks, shear tools, tweezer tips by PayPal|
|03 May||SMT 2016 all about automation|
|11 Apr||Annual sales and service event in Bangkok big success|
|15 Mar||Come visit us at Semicon China|
|04 Mar||HiSOL new distributor in Japan|
|01 Mar||Cellphone display LCD driver IC testing|
|13 Nov||ISO-Dynamique and Axend represent XYZTEC in Malaysia, Singapore, Thailand, Indonesia and Vietnam|
|12 Nov||Wire detect functionality popular at Productronica|
|30 Oct||How to: Cold Bump Pull|
|07 Sep||Condor Sigma draws attention at Semicon Taiwan|
|03 Jul||Exciting sales and service meeting in Bangkok|
|01 Jul||Bond Test Measurement Accuracy|