30 September 2013
There are many types of electrical spring contact, for example sliding contacts like those in connectors and switches and surface pressure contacts such as battery terminals and power distribution. The size, contact force, number of contact cycles and materials used varying depending on the application.
The performance of such contacts depends on characteristics like stiffness, deformation, material, moving mass and geometry. This can be analysed simply with the application of Hooke's law, or more complexly where dynamic effects such as the contacts sliding friction, force profile, damping constant or clamp force are investigated against time and distance.
For example material properties like Young’s modulus might be measured:
XYZTEC have many tests that can investigate and measure the static, dynamic and life performance of your spring contacts with contact forces from a few grams force up to hundreds of kilograms. In cases like button switches and circuit breakers a push-pull test can evaluate force versus time and distance as single or multiple events.
Our software offers full control over the test parameters including force, speed, distance and number of repeats. Data output can be in both numerical and graphical form, allowing full and varied analysis. The analysis can be performed either within the XYZTEC software or externally, using our comprehensive data exporting capability.
Our test platforms have auxiliary inputs for external sensors that might, for example, measure a failure of some kind that stops the test and records the number of cycles to the event.
Auxiliary inputs enable in-situ testing to measure contact properties such as resistance in real time and synchronously with mechanical inputs of position and force.
Did we catch your attention? Please contact us for more information or to request a demonstration or a quotation.
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|04 Dec||Condor Sigma stars in Audi Tech Day video|
|10 Nov||Raysun to represent XYZTEC in China|
|23 Oct||Award for First Technology China|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
|23 Jun||Presentation at CSPT 2017 by Bob Sykes|
|06 Jun||Condor Sigma in São Paulo, Brazil|
|16 May||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|28 Apr||Semicon Penang 2017 successful|
|28 Apr||Pizza and Go cart racing at K1 Speed in Northern CA|
|14 Mar||Visit us at Semicon China|
|16 Feb||Job opening for Junior Mechanical Design Engineer [closed]|
|29 Nov||Successful seminar in Russia with Sovtest|
|31 Oct||Market leading Condor Sigma bond tester at TPCA Taiwan|
|08 Sep||Automation features draw attention at Semicon Taiwan 2016|
|28 Jun||HTMG represents XYZTEC in South America|
|14 Jun||Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT) [UPDATED]|
|14 Jun||Purchase wire hooks, shear tools, tweezer tips by PayPal|
|03 May||SMT 2016 all about automation|
|11 Apr||Annual sales and service event in Bangkok big success|
|15 Mar||Come visit us at Semicon China|
|04 Mar||HiSOL new distributor in Japan|
|01 Mar||Cellphone display LCD driver IC testing|
|13 Nov||ISO-Dynamique and Axend represent XYZTEC in Malaysia, Singapore, Thailand, Indonesia and Vietnam|
|12 Nov||Wire detect functionality popular at Productronica|
|30 Oct||How to: Cold Bump Pull|