1 June 2014
Today we would like to highlight the latest addition to the XYZTEC Condor product family: the Condor Sigma W12.
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the tool and cameras in record speed. The 30nm resolution linear encoders ensure accurate positioning.
The Condor Sigma automation features ensure rapid testing of randomly selected positions on the wafer. Fiducial mark recognition can guarantee a high repeatability. Cameras also assist the operator to perform grading. The grading run functionality enables quick grading after a sequence of tests.
The Condor Sigma W12 can be equipped with up to two perpendicular cameras and a camera mounted on a trinocular microscope. We recommend using a low and a high magnification camera for best positioning and grading. A second monitor can show (live) camera images for ease of operation.
Compatibility with the XYZTEC Revolving Measurement Unit (RMU) ensures that you can switch between test types and tools with the press of a button. Unused sensors (cartridges) are protected within the machine.
The XY mapping function enables the operator to quickly and accurately move from position to position on the wafer by keying in a relative move. Naturally, the Condor Sigma W12 is equipped with 30nm resolution linear encoders, ensuring 0,5µm repeatability.
Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.
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|29 Jan||XYZTEC at Semicon Korea|
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|15 Nov||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
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|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
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