Highlighted: Condor Sigma W12 for 300mm wafer testing

1 June 2014

Today we would like to highlight the latest addition to the XYZTEC Condor product family: the Condor Sigma W12.

Condor Sigma W12

Ideal solution for 300mm (12 inch) wafer testing

  • Precision shear testing and Cold Bump Pull (CBP)
  • Bump sizes down to 20µm
  • Grading run functionality
  • XY mapping coordinates key in function
  • Easy positioning, alignment
  • High resolution cameras with high and low magnifications
  • Fastest throughput of wafer bump testing in the world
  • 500mm X-stage and 370mm Y-stage, throat depth 400mm
  • Integrated report editor and flexible data export
  • Reach 100% of the 300mm wafer without repositioning the wafer on the chuck
  • Blower and vacuum tool cleaning unit
  • Wafer chuck with safety interlocks and 360 degree rotation
  • Wafer carrier mechanically locked when vacuum is turned on
  • Complies with JEDEC JESD22-B117A, JEDEC JESD22-B115 and JEITA EIAJ ET-7407 standards
  • Also suitable for 200mm (8 inch) and other wafer sizes
  • 24 bit ADC resolution, 10kHz sampling frequency
  • Compatible with Revolving Measurement Unit (RMU) and single heads
  • Unparallelled 0.075% accuracy

Sigma W12 Wafer chuck
Sigma W12 Wafer chuck

The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the tool and cameras in record speed. The 30nm resolution linear encoders ensure accurate positioning.

The Condor Sigma automation features ensure rapid testing of randomly selected positions on the wafer. Fiducial mark recognition can guarantee a high repeatability. Cameras also assist the operator to perform grading. The grading run functionality enables quick grading after a sequence of tests.

Blower and vacuum tool cleaning unit mounted around the shear tool.  The unit is not connected to the cartridge, but to the machine frame.
Blower and vacuum tool cleaning unit mounted around the shear tool. The unit is not connected to the cartridge, but to the machine frame.

The Condor Sigma W12 can be equipped with up to two perpendicular cameras and a camera mounted on a trinocular microscope. We recommend using a low and a high magnification camera for best positioning and grading. A second monitor can show (live) camera images for ease of operation.

Compatibility with the XYZTEC Revolving Measurement Unit (RMU) ensures that you can switch between test types and tools with the press of a button. Unused sensors (cartridges) are protected within the machine.

The Condor Sigma W12 software allows the operator to quickly and accurately jump to the next test point
The Condor Sigma W12 software allows the operator to quickly and accurately jump to the next test point

The XY mapping function enables the operator to quickly and accurately move from position to position on the wafer by keying in a relative move. Naturally, the Condor Sigma W12 is equipped with 30nm resolution linear encoders, ensuring 0,5µm repeatability.

Condor Sigma W12 with calibration jig fitted
Condor Sigma W12 with calibration jig fitted


Click here to check the specifications and see whether the Sigma W12 is the right system for you, or if you should select a different Condor system.

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Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.


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