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5 September 2014

XYZTEC introduced an electronic newsletter today. Click here to subscribe and stay up to date about everything related to bond testing and our latest developments. The first newsletter is centered around our new 300mm wafer testing machine, the Condor Sigma W12:

Condor Sigma W12
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Sigma W12

The Condor Sigma W12 is based on XYZTEC’s market leading Condor Sigma platform. It shares many of the same features that set the Condor Sigma apart from the rest of the industry. The W12’s performance has been further enhanced for the precision and handling requirements of wafer testing.

Wafer testing up to 300mm

Condor Sigma W12 wafer chuck
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The W12 is designed to test any wafer size up to 300mm. Switching from various wafer sizes is a simple procedure. The goal was to minimize downtime for companies that have multiple wafer diameters. Many test types are possible on the Sigma W12. The most common include solder ball shear and Cold Bump Pull (CBP) testing. XYZTEC’s latest development is Pull Testing solder bumps on copper pillars. XYZTEC also offers solutions for wire bonds on wafer. With the widest range of sensors and tooling there is something to suit almost any bond test application.

Accurate fast full automation

All of XYZTEC’s axis movements are controlled with linear encoders. This technology provides unrivalled accuracy and it offers a significant improvement compared with rotary encoder solutions found on other equipment.

Condor Sigma W12 sideview
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Whether you are using the system in the manual or automatic mode, intelligent axis speed control of up to 50mm/s enables the fastest traverse time over long distances. However, the W12 employs an automatic slow down feature as the tool approaches the target. This feature ensures precision and safety. Set up time is minimal. Wafer-map import capability provides accurate and rapid data transfer of the bonds to be tested. Other production functions include; onboard barcode reading and SPC data down load.

Automatic and manual Load/Unload with warped wafer capability

The Sigma W12 offers stand-alone manual loading or it can be fully integrated with wafer loaders/un-loaders. With the optional rotary table feature, wafer orientation can be accomplished quickly and accurately using manual or automatic functionality. A range of vacuum chucks and pin transfer options enable the handling of the most challenging of wafers.

Failure mode image capture

A range of onboard camera options enable high magnification images of the failure mode. These can be saved along with the test data either automatically or under operator control.

Condor Sigma W12 Blower and Vacuum
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Debris collection

A debris collection option manages the debris resulting from test. Options include a programmable timed-pulse from an air jet to dislodge loose material from the test area, as well as a material vacuum pickup that captures loose material in a collection filter.


Dec 2019 Xyztec faces any challenge
Jul 2019 Meet the world’s biggest bond testers
Apr 2019 Free SMTconnect ticket? Register now
Aug 2018 Is Fully Automatic Bond Testing Possible?
Jul 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
Mar 2017 Fracture strength of thin wafers and die
Feb 2017 Centralized database for enhanced security and SPC options
Jan 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
Dec 2016 Coating and film testing
Nov 2016 Latest software release enables automatic grading
Oct 2016 Vision enhanced materials testing

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Other news

02 Mar EPIC invests in XYZTEC’s most advanced bond tester
17 Jan Visit us in Tokyo this month
13 Nov Visit us at Productronica in München
03 Oct Xyztec at EuWoRel Berlin
18 Sep Sigma and Magazine Loader in action at Semicon Taiwan
17 Sep Xyztec at EMPC conference in Pisa
04 Sep Meet us worldwide in September
05 Jul Teaming up with Micronnect B.V. and BRIDGE S.r.l.
07 May Newest Sigma HF High Force bond tester live in action at SMTconnect
26 Apr XYZTEC spreads bond testing knowledge to partners worldwide
20 Mar Visit us at Semicon China
29 Jan XYZTEC at Semicon Korea
21 Nov Presentation at CSPT 2018
15 Nov Matelec show 2018 for the Electrical and Electronics Industry with Antycip
20 Sep Successful ESTC Conference in Dresden, Germany
11 Jul LEGO® for Nepal sponsored by XYZTEC
05 Jun Visit us at SMT Hybrid Packaging Nuremberg
20 Apr Smart LED and Solar panels for XYZTEC head office
18 Apr XYZTEC workshop at IMAPS UK
16 Mar ODEOM shows Condor Sigma in Istanbul
15 Mar Semicon China under way
31 Jan Condor Sigma W12 at Semicon Korea
04 Dec Condor Sigma stars in Audi Tech Day video
10 Nov Raysun to represent XYZTEC in China
23 Oct Award for First Technology China

View all news

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