Automatic wire detection draws attention at SMT 2015

6 May 2015

XYZTEC Booth 7A-507
XYZTEC booth 7A-507 at SMT 2015, Germany

XYZTEC is exhibiting this week at SMT Hybrid Packaging 2015 in Nürnberg, Germany. The XYZTEC stand has been busy all week, with the automatic wire detection functionality and the Condor Sigma W12 for 12 inch wafer testing as the center of all attention.

The show will be open until Thursday May 7th, 17:00. Come and see the latest developments in bond testing, if you have the opportunity. Out booth has number 7A-507. Alternatively, click here to see which other shows XYZTEC will visit this year.


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