1 July 2015
Whilst many things can affect the force measurement accuracy of a bond test its ultimate limitation is that of the force sensor. For this reason alone and with no cost penalty why would you accept anything but the best? XYZTEC have taken accuracy to a new level with its latest range of Sigma bond testers. This market leading accuracy is also guaranteed without the need to select any force measurement ranges. How do we do it?
The limitation of a bond test is the force sensor measurement. The limitation of the force measurement should be the sensor load cell, sometimes called the transducer. The main cause of error in a load cell is sensitivity to temperature. Even small changes in temperature can have a significant and detrimental effect. The previous state of the art was to add hardware to the load cell strain gauge bridge that reduces output changes caused by temperature. This is a difficult procedure that requires the sensitivity to temperature to be measured and then an estimate of the required hardware correction applied.
Because of the time taken it is typically done with one iteration and at two temperatures. Leading the industry XYZTEC have added a temperature sensor to their force sensors. This makes temperature correction much easier and more accurate. The force output is simply measured at a range of standard loads and at a range of temperatures. The systems software then applies a force temperature map removing the uncertainty of estimates, approximations at limited calibration points.
Sensor ranges are an invention to overcome limitations in the conversion of the analogue sensor output into a digital one. Less capable Analogue to Digital Converters (ADC) have a resolution less than that of the sensor analogue signal. This means their accuracy is dictated by the ADC rather than the sensor and this is particularly bad when measuring low forces. To overcome this limitation ranges are used. Ranges apply the number ADC steps to typically 100%, 50% or 10% of the sensor output. It is a common misconception that ranges improve accuracy. They do not. They simply limit the negative affect of an insufficient ADC capability.
All Sigma sensors use 24 bit ADC with digitized resolution of 16,777,216 steps. In comparison alternative systems use 16 bit and 12 bit with 65,536 and 4,096 step respectively. It can be seen that this difference in digital resolution is really quite massive.
The Sigma with its 24 bit ADC does not need ranges to achieve its specified accuracy of ±0.075%. And its accuracy will be the best you can get when measuring at its maximum or low down in 10% of its full scale.
|Dec 2019||Xyztec faces any challenge|
|Jul 2019||Meet the world’s biggest bond testers|
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|24 Sep||Meet us at the Semicon Taiwan|
|02 Mar||EPIC invests in XYZTEC’s most advanced bond tester|
|17 Jan||Visit us in Tokyo this month|
|13 Nov||Visit us at Productronica in München|
|03 Oct||Xyztec at EuWoRel Berlin|
|18 Sep||Sigma and Magazine Loader in action at Semicon Taiwan|
|17 Sep||Xyztec at EMPC conference in Pisa|
|04 Sep||Meet us worldwide in September|
|05 Jul||Teaming up with Micronnect B.V. and BRIDGE S.r.l.|
|07 May||Newest Sigma HF High Force bond tester live in action at SMTconnect|
|26 Apr||XYZTEC spreads bond testing knowledge to partners worldwide|
|20 Mar||Visit us at Semicon China|
|29 Jan||XYZTEC at Semicon Korea|
|21 Nov||Presentation at CSPT 2018|
|15 Nov||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
|20 Sep||Successful ESTC Conference in Dresden, Germany|
|11 Jul||LEGO® for Nepal sponsored by XYZTEC|
|05 Jun||Visit us at SMT Hybrid Packaging Nuremberg|
|20 Apr||Smart LED and Solar panels for XYZTEC head office|
|18 Apr||XYZTEC workshop at IMAPS UK|
|16 Mar||ODEOM shows Condor Sigma in Istanbul|
|15 Mar||Semicon China under way|
|31 Jan||Condor Sigma W12 at Semicon Korea|
|04 Dec||Condor Sigma stars in Audi Tech Day video|
|10 Nov||Raysun to represent XYZTEC in China|