29 November 2015
As more and more companies are making the transition to automatic wire pull testing, the engineers are also finding out its limitations. On many products, the placement of wires is not consistent and simple automation programs will miss the wire or pull two wires at once. XYZTEC's Condor Sigma is the only bond tester in the world to overcome this problem with its automatic wire detect functionality.
The Condor Sigma high resolution cameras combined with advanced wire detect algorithms allow the bondtester to correct for production tolerances for every single wire and allow for automation, even with fine pitch wires. Additionally, the Sigma offers automatic and consistent positioning along the wire, which can be setup as a percentage between the first and second bond. Alternatively the pull position may be calculated to produce any required angle at either the first or second bond and the forces at both bonds calculated. Missing wires or recognition problems can be handled during the automation cycle or after, via extensive reports.
The system is surprisingly easy to use, with a flexible AOI editor. Positions can be taught by means of the microscope (3D) and/or any of the three cameras that can be fitted on the Condor Sigma. Wire detect is one of many image processing capabilities of the Sigma. The automatic wire detect function was introduced at Productronica in Germany and is most relevant to automotive customers, hybrids, LTC, COB, leadframes and strips with multiple wires.
Contact us to see what is possible on your samples.
|Dec 2018||The Science of Bond Testing|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.