16 December 2015
With the holidays approaching, now is the time to reflect on the year that is almost behind us. For us at XYZTEC, 2015 was a great year with a lot of success stories. As bond testing customers are recognizing the superior performance of the Condor Sigma, our sales went up by more than 50% worldwide. These record sales numbers are in turn enabling us to accelerate further developments going into 2016.
One of the most exciting facts is that the world's top 4 semiconductor packaging companies without exception all opted for the Condor Sigma W12 for their 12 inch wafer testing requirements, often integrated with different wafer handlers. We are proud to lead in technology and intend to expand our advantage by continuing to invest in automation, accuracy and vision. Please keep an eye out for these newsletters, as we will be announcing new features for your existing or new Condor Sigma's.
Because the goodwill of those we serve is the foundation of our success, it is a real pleasure at this holiday time to say "thank you" as we wish you a full year of happiness and success!
The XYZTEC team
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
|May 2015||USB Tweezers|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.