28 January 2016
The test volume is the X, Y and Z movements of the bond tester. Large X and Y strokes enable large samples like long lead frames, circuit boards and wafers to be tested. Large Z travel enables tall samples with high packaging walls or connectors to be handled.
When a tester is used for automation both the test tool and the camera have to be able to cover the required test volume. The focal point of the camera though is offset from the test tool and so some of the axis movements are required to move between the tool and the camera and are not available for the test volume. Generally a large test volume is a must for a flexible automatic system. Many bond testers though have surprisingly small test volumes of 50mm x 50mm x 65mm. Such machines have extremely limited automation capability. The Sigma has the largest standard test volume available.
As market leader in bondtesting in Europe and Taiwan, XYZTEC has produced lots of success stories since the company was incorporated in 2000. Click here for references. If you are interested in a live demonstration of the Condor Sigma on your sample or perhaps for more bond testing inspiration, contact us today!
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.