26 February 2016
There are plenty of reasons why all of the world's top 4 semiconductor packaging houses have purchased a Condor Sigma W12 for their 12 inch wafer testing requirements, during the past few months. In this newsletter we highlight a few key features of this market leading bond tester.
Together with the market leaders of wafer handling equipment we offer a fully integrated and automated solution. We offer leading edge products for up to 300mm equipment frontend module (EFEM) platforms.
The Condor Sigma W12 features automatic wafer size detection, PID controlled centered lift pins for guaranteed secure wafer loading and un-loading.
In most cases the high air flow of XYZTEC vacuum chucks easily pulls down warped wafers. In cases of extreme warpage an optional wafer pusher ensures precise clamping.
To make sure no debris is on the wafer or on the chuck a special cleaner is offered to perform fully automated pre- and post test cleaning.
The Condor Sigma software offers import- and export of multiple file formats for wafer maps (KLARF, INF, etc.). After the import the map shows a complete overview. The system will guide you step by step through all marked defects.
The tested positions are clearly marked on the map. When all tests are finished, the wafer map and test results can be exported for full traceability. For each die a high resolution picture can be made that shows and marks the tested bumps. An offline viewer is available to check the exported wafer map files and the test results.
As market leader in bondtesting in Europe and Taiwan, XYZTEC has produced lots of success stories since the company was incorporated in 2000. Click here for references. If you are interested in a live demonstration of the Condor Sigma on your sample or perhaps for more bond testing inspiration, contact us today!
|Dec 2019||Xyztec faces any challenge|
|Jul 2019||Meet the world’s biggest bond testers|
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.