31 August 2016
XYZTEC is always innovating and developing advanced solutions in bond testing. In this newsletter we present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C.
The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating. With 27 heater elements in 7 different control groups it quickly warms up its aluminum table and customer sample with an accuracy of less than ±5°C. The table is designed to remain extremely flat and to deliver a perfect vacuum even at the highest temperatures.
Triple heat shieldings around the Revolving Measurement Unit (RMU) protect the inner workings of the bond tester against prolonged high temperatures. A WindowsTM based temperature controller with various heating profiles gives the user complete flexibility. Multiple heating profiles can be configured and stored.
With the high accuracy bond tester comes a sample carrier and cooling down rack to make the handling of the large (hot) panels easy. The carrier can be positioned accurately before testing and then safely cool down after the automatic tests.
To be able to test all of the sample area the large rotating heater stage can move to four fixed rotation positions and automatic testing is easily programmed by the engineer. All the flexibility that customers have come to expect from XYZTEC, including vision corrections, are also available.
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.