30 November 2016
In this newsletter, we describe the exciting new features XYZTEC has incorporated in its latest Condor Sigma software release. Customers are recommended to upgrade, so they can benefit from all the new free features. The advanced Halcon fiducial recognition and SECS/GEM may require additional licences.
One of the most exciting additions in version 5.8 of the Condor Sigma software is automatic grading for ball shear testing. Using the advanced Halcon library and high resolution perpendicular cameras with smart lighting systems, we have achieved successful determinations of failure modes for several customers. The computer can accurately determine the percentages of brittle and ductile failures.
The same library is also used for advanced fiducial recognition for applications that have difficult and inconsistent fiducial marks or where no fiducial marks exist enabling other features to be used. The advanced shape recognition features of Halcon allow engineers to use separate color channels and several image filters. Image segmentation techniques can help to further isolate the unique features that the engineer is interested in. The result can be used as the basis for positioning correction (for example wire detect).
Several small changes to the status bar make the software easier to work with. For example, it is now possible to change the working position and selected camera by a simple click.
Using composite surface imaging techniques, it is possible to accurately determine the heights of a feature on your sample. This can be used for multiple purposes, like determining loop heights without actually touching the wire. It is also possible to produce images wherein everything is in focus.
The programming of an automation sequence just got a whole lot easier, with the possibility to execute fiducials during programming. Even if the sample has slightly moved or is replaced with a different sample, running the fiducials from the editor will ensure that added or changed test positions and commands are correct.
Automation programming can now be done from the tool position or either of the camera systems on your Sigma. Another improvement is that it is now possible to check fiducials against multiple photos so that failed recognitions during the automation runs occur less often.
Several small and large improvements were made for wafer testing. Among other things, version 5.8 provides enhanced support of wafer tables with vacuum detect sensors. The engineer also gets more flexibility when working with the patented contactless CBP Jaw Cleaner. The standard cleaning process is improved and large wafer maps are displayed better and faster. Click here to see our latest W12 automation video.
SECS/GEM is an equipment interface protocol for equipment-to-host data communications in the semiconductor industry. Among other protocols, XYZTEC offers SECS/GEM communication directly in the Condor Sigma software or via an EFEM. Contact XYZTEC for more information and options for your factory.
A built-in export editor is introduced. This enables the engineer to create his own reports in almost any format, to be saved to a file or the clipboard.
The Condor Sigma software also has improved networking support. Multiple bond testers can now share a centralized database. In close cooperation with our customers, we made sure it is possible to share certain settings while keeping others machine specific.
Click here to download Condor Sigma software version 5.8 and upgrade now. Contact your local XYZTEC distributor to assist you if required.
References are available and happily provided.
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.