Newsletter: Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis

31 January 2017

6.4M pixel vertical view camera system with coaxial (light field) and improved diffused (dark field) illumination
6.4M pixel vertical view camera system with coaxial (light field) and improved diffused (dark field) illumination

XYZTEC release a range of 6.4M pixel vertical view camera systems with the addition of Coaxial (Light Field) and improved Diffused (Dark Field) illumination. These new systems increase automation capability and complement our existing high magnification image capture.

The all new systems come with magnifications of 5X, 3X or Wide View (corresponding fields of view 1.5x1mm, 2.7x1.8mm and 15x11mm). This range covers high magnification test failure mode analysis and image capture through to fiducial mark analysis and wire detect enabling full automatic testing even when the position of the wires varies between sample batches.

One, two or three vertical view camera systems can be mounted on a Sigma bond tester enabling the full range of magnifications. The systems are rigidly mounted with no moving parts (like mechanical zooms) to ensure the highest image positional accuracy. The new 6.4M Pixel camera chip and precision optics ensure the spatial resolution required for every application even when using digital zoom.

Diffuse, dark field lighting brings out curved surfaces like these wires
Diffuse, dark field lighting brings out curved surfaces like these wires
Coaxial, light field lighting enhances flat reflective features like fiducial marks
Coaxial, light field lighting enhances flat reflective features like fiducial marks

In this dark field example many wires are clearly made visible for easy camera programming of wire and bond positions. If the position of wires varies between samples our wire detect option automatically makes the required correction for each test.

Diffused (dark field) illumination brings out the wires for automatic detection
Diffused (dark field) illumination brings out the wires for automatic detection

Failure mode analysis is easy with our image capture options. This example of 250µm solder ball zone shear (total ball shear) at 50mm/s shows how 6 different failure modes are clearly visible.

Microscope view: tests 1, 2 and 3
Microscope view: tests 1, 2 and 3
Microscope view: tests 4, 5 and 6
Microscope view: tests 4, 5 and 6
All six tests (1, 2, 3 on the top row; 4, 5, 6 on bottom row). Large field of view Dark Field
All six tests (1, 2, 3 on the top row; 4, 5, 6 on bottom row). Large field of view Dark Field
All six tests (1, 2, 3 on the top row; 4, 5, 6 on bottom row). Large field of view Light Field
All six tests (1, 2, 3 on the top row; 4, 5, 6 on bottom row). Large field of view Light Field
Grading failure modes of all tests
Grading failure modes of all tests

Learn more about the Condor Sigma

As the market leader in bond testing, XYZTEC has produced many success stories over the years. Since our founding in 2000, we are dedicated to one thing and one thing only…..BOND TEST SOLUTIONS! We continue to develop solutions for all types of industries including solar, space, military, medical, automotive, interconnect and material science. Our customers include market leaders in all of these industries throughout the world. See why many people refer to our Condor Sigma as the Swiss army knife of bond testers If you are interested in a live demonstration of the Condor Sigma on your sample or perhaps for more bond testing inspiration, contact us today!

References are available and happily provided.

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