20 November 2014
Many of us have made a bond test. We obtain results from our tests. The big question is “What do we do with the data to improve our processes?” XYZTEC offers multiple solutions for process and QA engineers. Our award winning Condor Sigma bondtester features many 'software functions that allow users to capture and analyze their data, at no additional charge.
When setting up a test method (recipe), XYZTEC allows the operator or engineer to include SPC controls. The SPC results can be shown live on screen or reported later after doing hundreds or even thousands of measurements. This data allows operators, engineers and managers to observe trends and make key decisions regarding their processes.
In conjunction with our SPC data capture features, XYZTEC offers a number of data analysis tools. All of this additional information being accessed quickly using our intuitive query function from the SQL server database. The graphical user interface is easily customized for your specific needs. We also offer scriptable test methods for more exotic applications.
XYZTEC develops and maintains the Condor Sigma software in house. We do not outsource this critical function. Our software developers are located on site, working hand in hand with our hardware engineers and can implement changes almost immediately. XYZTEC software engineers are also available to support you with more exotic export formats and/or methods that may be specific for your organization.
So, if process verification is important to your business, it is essential to have available the right tools. Make sure you do not fall behind your competitors and choose for the state-of-the-art XYZTEC Condor Sigma with its unique built-in SPC package.
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|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.