18 December 2014
Copper Pillar is rapidly being adopted as a bumped wafer interconnect. The construction is that of a Copper cylinder around 50µm in diameter and height, topped with a dome of solder.
As with any interconnect the quality of the bonding process between the different parts is vital for the reliability of the finished product. The bond between the copper and its pad on the wafer are of particular interest as this is seen as the most likely failure mode. In a bond test a failure mode between the copper and wafer is then the “Failure mode of interest”. This failure mode can be produced by either a pull or a shear test and the measured bond strength used for process control.
The choice between pull or shear testing depends on the application and the test objectives. If you are interested to find out more please contact us for more information, to request a demonstration or a quotation.
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Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.