26 January 2015
With the Revolving Measurement Unit (RMU), XYZTEC offers an unique multiple load cell cartridge for measuring all kinds of horizontally and vertically tested bonds, using pull, peel, push or shear methods; either destructive or non-destructive. The key point is the automatic selection of the pull or shear tool and corresponding measurement sensor by software.
Eliminating manual cartridge changes, the RMU allows for very simple standard operating procedures to exchange sensors, without the risk of damage. Functions and applications are changed in 5 seconds, under software control. Both software and hardware are designed to prevent any damage when applications are exchanged.
If one sensor (transducer) is broken, the other sensors remain available for instant and convenient use. The advantages are clear: constant high UPH, improved repeatability and reproducibility and therefore increased Cpk results.
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|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
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|Jun 2016||Get 10% off your next tools order|
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|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
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|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.