27 March 2015
Bond testers are traditionally used for force measurement only, but the extreme positional accuracy of the Condor Sigma platform also enables you to measure whether the dimensions of your product are within specification, with never before seen accuracies. The system is equipped with 30nm resolution linear encoders and is completely backlash free (no gear box).
On any Condor Sigma bond tester, the loop height measurement test method is available for free using pull sensors. The system will accurately determine the height of a wire, ribbon or other component above the surface. The measurement result in this case is not a force, but a distance. It is just as easy to analyze distance data as to analyze force data with the Sigma.
To enable quicker testing, the system can store the Z-height of the surface under the first wire and use this value again when sensing the following multiple wires. It is also possible to probe the surface height in a different spot than directly under the wire. Click here to read more...
The probe test method is available on any Condor Sigma for free using pull or shear sensors. The system will accurately determine the Z-height of two positions and compare them to each other.
One can choose a programmed X/Y offset between the two points, or program the method so that the tester will move a certain distance in the direction in which your tool is pointing. The Probe test method is of course available for both manual and automatic testing.
The Condor Sigma is also unique because of its programmable landing force down to 2,5 gf. Combined with an also programmable probe test speed, this enables very delicate sensing. Deformations or damage to the sample are therefore minimized.
XYZTEC announces that it is teaming up with Schmidt Scientific Taiwan Ltd. (SST), an experienced company that serves Taiwan and mainland China. SST has decades of experience selling bond testing equipment and is now opting for the technology leader. Both companies see this as a logical step to keep up with XYZTEC’s rapidly increasing market share. SST is a great addition to the international sales and distribution network for the Condor Sigma. “We could see XYZTEC was the better way forward for us”, says Jim Lin, Vice President of SST. Click here to read more...
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|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
|May 2015||USB Tweezers|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.