XYZTEC is the technology leader in bond testing worldwideCopyright XYZTEChttp://www.xyztec.cominfo@xyztec.comen60Thu, 03 Oct 2019 12:16:22 +0200http://www.xyztec.com/news/144/Xyztec-at-EuWoRel-Berlinhttp://www.xyztec.com/news/144/Xyztec-at-EuWoRel-BerlinThu, 03 Oct 2019 12:16:22 +0200This week, Xyztec was at EuWoRel at Fraunhofer-Forum Berlin to present improvements in the comprehensiveness and efficiency of experimental reliability tests and methods for characterizing the physics of bond failure. 7th 'European Expert Workshop on Reliability of Electronics and Smart Systems' Since 2013, EuWoRel is the annual forum for addressing the concerns of reliability, robustness, and functional safety of new products and technologies in the field of electronics and smart systems. Key experts from research institudes and the industry are coming togeter to further research requirements on reliability methodology clearly visible, not only to the electronics and smart systems community but also to the representatives of funding gencies at national and European levels. Xyztec at EuWoRel Berlin 2019http://www.xyztec.com/news/143/Sigma-and-Magazine-Loader-in-action-at-Semicon-Taiwanhttp://www.xyztec.com/news/143/Sigma-and-Magazine-Loader-in-action-at-Semicon-TaiwanWed, 18 Sep 2019 23:59:59 +0200Find out what is new about the industry and come to see the Sigma and Sigma MAG Magazine loader live in action. Visit us this week at the annual Semicon Taiwan from September 18th until September 20th at the TWTC Nangang Hall 1 in Taiwan. Our distributor Schmidt Scientific Taiwan Ltd. (SST) (booth L0428) is exhibiting the Sigma MAG a magazine handler for automated lead frame testing and Kingyoup Enterprises (booth N0862) is exhibiting with the Sigma. Below is an impression of the booths. SST exhibiting the XYZTEC Sigma MAG at Semicon China 2019 Kingyoup exhibiting the XYZTEC Sigma at Semicon Taiwan 2019http://www.xyztec.com/news/141/Xyztec-at-EMPC-conference-in-Pisahttp://www.xyztec.com/news/141/Xyztec-at-EMPC-conference-in-PisaTue, 17 Sep 2019 23:59:59 +0200This week XYZTEC is exhibiting at EMPC 2019 in Pisa (Italy). Additionally, XYZTEC’s Bob Sykes provided a half day course on The Science of Bond Testing. The course became an interesting interactive session, covering a variety of test types and customer cases. As is often the case, the discussions continued during the coffee an lunch breaks. The attendees came from a wide variety of bond tester users, and shared their bond testing problems and experiences with each other. The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event. EMPC 2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. XYZTEC is exhibiting ate the EMPC 2019 in Pisahttp://www.xyztec.com/news/140/Meet-us-worldwide-in-Septemberhttp://www.xyztec.com/news/140/Meet-us-worldwide-in-SeptemberWed, 04 Sep 2019 23:59:59 +0200As market leader around the world, Xyztec is everywhere to offer global presence and local support. Discover our products this month at one of these events: CIOE in China (Azia) from 4 September 2019 - 7 September 2019 The Battery Show in Novi, Michigan (USA) from 10 September 2019 - 12 September 2019 EMPC conference in Italy (Europe) from 16 September 2019 - 19 September 2019 Semicon Taiwan in China (Azia) from 19 September 2019 - 20 September 2019 This week XYZTEC is at the China International Optoelectronic Exposition (CIOE) in Shenzhen Convention & Exhibition Center. Find and source the top-class optoelectronic products from components to applications in most optoelectronic fields. CIOE is regarded as an annual industry gathering to meet clients, suppliers, distributors, and partners under one roof. It also serves as the gateway to China’s optoelectronic industry. Our distributors First Technology China (FTC) is exhibiting (no. 2528 and 2529) with Sigma, the most advanced bond tester Sigma with full automation capability. FTC exhibiting the XYZTEC Sigma at CIOE 2019 in Chinahttp://www.xyztec.com/news/newsletter-36/Meet-the-world%E2%80%99s-biggest-bond-testershttp://www.xyztec.com/news/newsletter-36/Meet-the-world%E2%80%99s-biggest-bond-testersMon, 15 Jul 2019 23:59:59 +0200Higher forces or a larger test area, this highly configurable bond tester can do it all. XYZTEC proudly announce world’s biggest bond testers which are capable to test high forces up to 1000 kgf and large test volumes with speeds up to 500 mm/s. Minimize handling risks by testing and analysing fully automatically. Set references for fiducial marks and program comprehensive automation positions and commands from the camera. Examinig the samples using image processing, the AOI measuring toolkit and auto grading. Meet the new Sigma L, XL and HF. Now online on our website. Sigma HFHigh Force bond tester for forces up to 1000 kgfThe Sigma HF (High Force) an ideal test system for IGBT power modules and other high force applications for forces up to 1000 kgf and a test volume of 500 mm in X and Y combined with 200 mm in Z. Sigma HF is a bond tester for forces up to 1000 kgf Sigma HF in action Ask us for a demonstration and learn more about the strongest bond tester on the market. Unique specifications in a glance Single measurement unit for up to 500 kgf or up to 1000 kgf 360° rotational shear head Up to 5 cameras Large working area of 500x500x200 mm Sigma L and XLFor large area bond testers for large area applicationsThe Sigma L and XL are especially for large area applications such as automotive battery testing and high force applications that involve larger products such as battery packs and large Panel Level Packaging (PLP). Extra large working area of 500x800x200 mm Sigma L (Large); with a working area of 500x500x200 mm Sigma XL (Extra Large); with an extra-large working area of 500x800x200 mm Unique specifications in a glance 0.075% accuracy Six sensors Revolving Measurement Unit (RMU) with forces up to 200 kgf Up to 2 perpendicular automation cameras Large working area of 500x500x200 mm or 500x800x200 mm Click here to check the specifications and compare the Sigma HF, Sigma L, Sigma XL and the other Sigma systems. Contact us Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.http://www.xyztec.com/news/139/Teaming-up-with-Micronnect-B.V.-and-BRIDGE-S.r.l.http://www.xyztec.com/news/139/Teaming-up-with-Micronnect-B.V.-and-BRIDGE-S.r.l.Fri, 05 Jul 2019 23:59:59 +0200Technology leader XYZTEC keeps expanding by adding two new European distributors to the team. XYZTEC would like to welcome Micronnect B.V., which will serve The Netherlands and Belgium, and BRIDGE S.r.l. a new contact for Italy and Malta. Both companies are already experienced with bond testing and enthusiastic to be part of the XYZTEC team. Micronnect B.V. is the “One Stop Shop” company to European users and serves 150 organizations in 21 countries for bonding products (equipment, tools and materials) and services (maintenance, training and process optimization). BRIDGE S.r.l. Philosophy is to connect (bridge) bonding equipment among which XYZTEC’s bond testers with the Italian customers. More than 25 years of experience in Electronics, Semiconductors and Automations, allow BRIDGE to provide valuable support to the customers. Micronnect and BRIDGE are both great additions to XYZTEC’s international sales and distribution network. After an intensive sales- and service training last week at the XYZTEC HQ in Panningen, they are completely ready to represent XYZTEC in Europe. Micronnect B.V.High-tech campus 95656 AE EindhovenThe Netherlandswww.micronnect.euTel: +31-40 294 02 65 BRIDGE S.r.l.Via Breda, 30/710010 Burolo (TO)Italywww.bridge-automation.comTel: +39 3492386092 http://www.xyztec.com/news/136/Newest-Sigma-HF-High-Force-bond-tester-live-in-action-at-SMTconnecthttp://www.xyztec.com/news/136/Newest-Sigma-HF-High-Force-bond-tester-live-in-action-at-SMTconnectTue, 07 May 2019 23:59:59 +0200Come and visit us this week at the SMTconnect from May 7th until May 9th at the Nuremberg Messe in Germany. At our extended booth in Hall 4A/147 we present the new version of the Sigma HF high force bond tester and a fully automated Sigma bond tester with magazine handler for automated lead frame testing. The SMTconnect is the ideal setting where the electronic production community comes together for sharing ideas. A wide range of highly professional podium discussions, product unveilings and company presentations can be experienced at Europe’s leading event for system integration in microelectronics. No ticket yet? Click here and send a short e-mail including your full name, telephone number and company name. You will receive the corresponding code from us to register for the SMTconnect free of charge. We look forward to seeing you at our booth! http://www.xyztec.com/news/133/XYZTEC-spreads-bond-testing-knowledge-to-partners-worldwidehttp://www.xyztec.com/news/133/XYZTEC-spreads-bond-testing-knowledge-to-partners-worldwideFri, 26 Apr 2019 23:59:59 +0200One of our goals as technology leader in bond testing is “global presence and local support”. The key to this success is to spread knowledge through our annual sales and services meetings. This week, XYZTEC held the sales and service training in Bangkok to share our knowledge with our Asian partners. Over 30 sales and service engineers from Greater China, Japan and the rest of Asia Pacific participated in this interactive training in Bangkok. As always, the meeting included a technology update. This year several software updates concern automated testing and automatic analysis. Furthermore, the relevant sales and service details on the latest XYZTEC bond tester platforms capable of testing high forces and large working areas with extreme precision were uncovered. The XYZTEC Sigma HF is capable of applying accurate rotational shear, pull and push forces for forces up to 1000 kgf, for example for high power devices. Similar bond testers, the Sigma L and Sigma XL, are extremely relevant for applications requiring larger working areas, with forces up to 200 kgf using our state of art Revolving Measurement Unit (RMU). More information about these bond testers will follow very soon. Come and see the new version of our High Force bond tester at the SMTconnect in Nuremberg in the second week of May. Successful sales stories were shared among distributors, the latest innovations on the Sigma MAG, also available with safety cabinet, were discussed and our partners had the opportunity to update their skills and knowledge. The training was productive and fun and our partners are ready to provide our customers the best support at all times! http://www.xyztec.com/news/newsletter-34/Free-SMTconnect-ticket%3F-Register-nowhttp://www.xyztec.com/news/newsletter-34/Free-SMTconnect-ticket%3F-Register-nowTue, 16 Apr 2019 23:59:59 +0200SMTconnect Germany 2019 May 7-9, 2019 in Nuremberg - Hall 4A, Booth 147 The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with the new motto: "Solutions for electronic assemblies and systems". At our booth 4A/147 we will introduce you to interesting automated bond testing solutions for high forces, large working areas and lead frames. Sigma HF is a bond tester for forces up to 1000 kgfSigma HF – Come and see the new version of our High Force bond tester!The next millennium has begun. XYZTEC has developed a new test system capable of applying accurate shear, pull and push forces for automotive battery applications and applications requiring larger working area or higher forces up to 1000 kgf. Condor Sigma MAG is a fully automatic magazine handler for lead frame testingSigma MAG – Magazine handler live in action! By combining our state of the art Sigma with an independent lead frame loader/un-loader, we can offer a hands-off fully automated bond test solution for testing all sizes of lead frames, cassettes, magazines, PCB’s, Flex and boat carriers. Use our ticket service Click here and send a short e-mail including your full name, telephone number and company name. You will receive the corresponding code from us to register for the SMTconnect free of charge. We look forward to seeing you at our booth! Bob Sykes We are both delighted and disheartened to announce that XYZTEC's CTO Bob Sykes retires in April 2019. Since joining XYZTEC in 2009 Bob has made a major contribution in the company’s growth, with XYZTEC transcending from one of the important players in the bond testing market to its number one spot today, both in technology and worldwide annual sales. The Condor Sigma and several XYZTEC patents being among his major accomplishments. His retirement is not really a goodbye. Bob will remain active for XYZTEC towards the future, but obviously less intensively. We wish Bob all the best in this next chapter of his life. We are hiring! We are looking for an Electronic Engineer for our HQ in Panningen, The Netherlands. The job description below is in Dutch, as the job opening is for our Dutch office. However, good English capability is required. Electronic Engineer Kun jij elektronische schakelingen ontwerpen? Ben jij breed inzetbaar voor het ontwikkelen en testen van meetmethodes voor grote spelers in de semiconductor industrie? Lijkt het je leuk de wereld over te reizen met ons salesteam om deze applicaties te demonstreren? Reageer dan nu op deze functie!http://www.xyztec.com/news/131/Visit-us-at-Semicon-Chinahttp://www.xyztec.com/news/131/Visit-us-at-Semicon-ChinaWed, 20 Mar 2019 23:59:59 +0100XYZTEC is at Semicon China this week from March 20th until March 22th. This leading exhibition for China's semiconductor industry is held at the Shanghai New International Expo Centre. Our distributors First Technology China (FTC) Hall N3, booth 3617, Schmidt Scientific Taiwan Ltd. (SST) Hall N4, booth 4251 and Raysun Hall E3, booth 3474 are exhibiting our products and latest developments, such as the Sigma W12 for wafers and the Sigma MAG Magazine Loader. Below is an impression of the booths. FTC exhibiting the XYZTEC Sigma W12 and Sigma MAG at Semicon China 2019 SST exhibiting the XYZTEC Sigma at Semicon China 2019http://www.xyztec.com/news/130/XYZTEC-at-Semicon-Koreahttp://www.xyztec.com/news/130/XYZTEC-at-Semicon-KoreaTue, 29 Jan 2019 23:59:59 +0100Last week, XYZTEC was exhibiting at the Semicon Korea 2019 from 23th of January to 25th of January in Seoul. It is one of the largest exhibitions in Asia, with over 50.000 visitors, for the production of semiconductors and flat panel displays as well as for the photovoltaic industry, the nanoelectronics and micro technology. XYZTEC was presenting its best seller bond testers in Asia, the Sigma and the Sigma W12 with EFEM integration and its latest automation features. If you missed the show and still would like to see the Sigma, please visit us at one of the upcoming exhibitions IMAPS Device Packaging USA or Semicon China in March 2019. Get an impression and watch the 360-degree video. http://www.xyztec.com/news/124/Presentation-at-CSPT-2018http://www.xyztec.com/news/124/Presentation-at-CSPT-2018Wed, 21 Nov 2018 23:59:59 +0100Cor van Mil delivers speech about “What is Sigma” and automatic bond testing at CSPT 2018 Also this year, XYZTEC was a participant at the yearly China Semiconductor Packaging and Test Technology & Market Conference 2018 to present the latest developments in automatic bond testing. Hundreds of visitors attended the presentation on "What is Sigma" about what is needed for automatic bond testing and how to perform a perfect shear and pull test. With the most advanced bond tester, the Condor Sigma, fully automatic bond testing is possible. XYZTEC offers the full package for automatic bond testing consisting of automatic loading, testing and analysis. Cor van Mil presenting at CSPT 2018: What is needed for automatic bond testing? China Semiconductor Packaging and Test Technology & Market Annual Conference is the only authoritative and most widely recognized professional seminar covering the entire semiconductor packaging and testing industry in China. The 16th annual conference was successfully held in Hefei China on November 19 till 22. The conference was about "integrated innovation, intelligent production, integration and sharing". Presentation at CSPT 2018 in Hefei China about automatic bond testing in front of hundreds interest visitors. The audience among which many government leaders and leading corporations that employ bond testing were very interested about the automation possibilities for bond testers and the other subjects presented. XYZTEC, your partner in backend automation. XYZTEC booth at CSPT 2018http://www.xyztec.com/news/123/Matelec-show-2018-for-the-Electrical-and-Electronics-Industry-with-Antyciphttp://www.xyztec.com/news/123/Matelec-show-2018-for-the-Electrical-and-Electronics-Industry-with-AntycipThu, 15 Nov 2018 23:59:59 +0100Visit our distributor Antycip at the Matelec show 2018 in Madrid - Spain. An International Trade Fair with 140.000 m2 of innovation about the electrical, electronics and telecommunications indusstry. Come and live your matelec experience from 13 till 16 November (Hall 2 - 2C06). http://www.xyztec.com/news/122/Successful-ESTC-Conference-in-Dresden-Germanyhttp://www.xyztec.com/news/122/Successful-ESTC-Conference-in-Dresden-GermanyThu, 20 Sep 2018 23:59:59 +0200XYZTEC at ESTC conference in Dresden, Germany The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. XYZTEC, technology leader in bond testing, was present to discuss and share information about fully automated bond testing. This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event. XYZTEC at ESTC conference in Dresden, Germanyhttp://www.xyztec.com/news/newsletter-33/Is-Fully-Automatic-Bond-Testing-Possible%3Fhttp://www.xyztec.com/news/newsletter-33/Is-Fully-Automatic-Bond-Testing-Possible%3FWed, 29 Aug 2018 23:59:59 +0200Is Fully Automatic Bond Testing Possible? Abstract Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is possible with a modern bond testing system. Introduction In its infancy bond testing was wire pull, followed by die and ball shear. It evolved to satisfy the ever increasing diverse range of semiconductor and electronic applications. This requirement continued to evolve requiring ever more advanced test methods to keep pace with new technology. This became the first priority and kept bond tester designers busy. If bond testing needed to test all the bonds being made, full automation would have been developed from the very beginning. But as only a relatively small number of bonds required testing, the development and capital cost equations of bond testing differed from that of production machines. Attempts were made to add automation but most cases lacked the resources and ultimate commitment from both equipment suppliers and end users to provide what the industry might expect. Being involved from the beginning, always wanting to achieve full automation and born of experience rather than capital investment, a few very experienced bond tester designers started to see how it might be achieved. Fig 1 A modern bond tester There was never any doubt about the benefits of automation. Apart from the obvious saving in operating costs it should be faster, but perhaps most importantly it could test more consistently and accurately. The only justification for bond testing at all is to measure the quality of your bonds and in so doing maintain and improve, production yield and product reliability. This being the only reason for a bond tester’s existence should make accuracy the highest priority for any bond tester designer. Continue to read: Introduction What is Required for Automation? What is Possible with Modern Automation?Multiple test headsAccurate tool positioningAutomatic load and unloadMachine VisionMeasurement of gross sample position (fiducial camera alignment)Accurate automatic alignment for variations in bond positionAutomatic failure mode analysis (auto grading)Test debris managementNon-Destruct TestingConclusionhttp://www.xyztec.com/news/121/LEGO%C2%AE-for-Nepal-sponsored-by-XYZTEChttp://www.xyztec.com/news/121/LEGO%C2%AE-for-Nepal-sponsored-by-XYZTECWed, 11 Jul 2018 23:59:59 +0200 The first exchange in April 2018 of the project “LEGO® voor Nepal” sponsored by XYZTEC was a great experience with an even greater result. The project "LEGO® for Nepal" is part of Stichting Edulent en Volunteer Society Nepal. Its goal is to enable young people in Nepal to become acquainted with science, technology, architecture and mathematics. Research has shown that when young people make contact with science and technology at an early stage, they are more likely to develop interest and talent for this. The FIRST®LEGO®League team Casimir Tech from Eindhoven participated in this first exchange program. The students from the Netherlands learned the CBIA students from Nepal (Kathmandu) about building robots, teamwork, programming and core values. The project not only had a significant impact on the participants, but also a positive impact on the entire local community in which they live. The students from Nepal now have a programming class weekly. XYZTEC is proud to participate in this project. May future exchanges the coming years being even more successful. Click here to view the videohttp://www.xyztec.com/news/120/Visit-us-at-SMT-Hybrid-Packaging-Nuremberghttp://www.xyztec.com/news/120/Visit-us-at-SMT-Hybrid-Packaging-NurembergTue, 05 Jun 2018 23:59:59 +0200XYZTEC is at SMT Hybrid Packaging Nuremberg this week from June 5th until June 7th at the Nürnberg Messe in Germany. Europe’s leading event for system integration in microelectronics.Come and visit us at Hall 4A booth no. 331 where we present our two latest machines the Condor Sigma High Force and the Condor Sigma MAG a magazine handler for automated lead frame testing.http://www.xyztec.com/news/119/Smart-LED-and-Solar-panels-for-XYZTEC-head-officehttp://www.xyztec.com/news/119/Smart-LED-and-Solar-panels-for-XYZTEC-head-officeFri, 20 Apr 2018 23:59:59 +0200LED Panels with Chess WISE MyriaMesh Building Light Control The XYZTEC head office in Panningen was recently upgraded with new energy efficient LED panels with Chess WISE MyriaMesh Building Light Control. The wireless system ensures the light is only turned on when needed, for additional energy savings. Also, new lighting options are enabled such as dimming based on the available daylight and scenes for the meeting room. The panels were delivered and installed by ALL Lighting. Solar panels on XYZTEC building roof At the same time, solar panels were installed on the roof of the XYZTEC head office for an estimated 30MWh per year.http://www.xyztec.com/news/118/XYZTEC-workshop-at-IMAPS-UKhttp://www.xyztec.com/news/118/XYZTEC-workshop-at-IMAPS-UKWed, 18 Apr 2018 23:59:59 +0200MicroTech 2018 Last week, IMAPS-UK celebrated 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS at the Royal Holloway University of London. XYZTEC hosted a half day Workshop "Science of bondtesting", by Bob Sykes. The workshop was highly appreciated and sold out. XYZTEC exhibited at the show through its UK distributor PDP.Continuing the events theme “MOORE THAN PACKAGING: 50 Years Gone; 50 Years on”, the Annual Conference will bring together experts from across the microelectronics sector to discuss the latest technologies and developments, as well as providing a platform to highlight current commercial opportunities. XYZTEC's Bob Sykes and Volker Loibl-Kähler at IMAPS UK with distributor PDPhttp://www.xyztec.com/news/117/ODEOM-shows-Condor-%3Ci%3ESigma%3C%2Fi%3E-in-Istanbulhttp://www.xyztec.com/news/117/ODEOM-shows-Condor-%3Ci%3ESigma%3C%2Fi%3E-in-IstanbulFri, 16 Mar 2018 23:59:59 +0100Currently, our Turkish distributor ODEOM is exhibiting the XYZTEC Condor Sigma at WIN Eurasia in Tüyap, Istanbul. The exhibition is until Sunday 18 March, 17:30. ODEOM and XYZTEC EMEA sales manager Volker Loibl-Kähler at WIN Eurasia 2018