For the second year in a row, xyztec CTO Bob Sykes was invited to speak at China Semiconductor Packaging Test Symposium (CSPT).
Recent and Future Advances in Bond Testing
Hundreds of visitors attended the presentation on „Recent and Future Advances in Bond Testing“. The audience among which many leading corporations that employ bond testing was very interested in the subjects presented.
Presentation by Bob Sykes
Among the presented topics were the current state of technology in vision analysis and illumination, coating and film testing and xyztec’s brand new lead frame handler.
China Semiconductor Packaging Test Symposium (CSPT)
CSPT is a professional conference that focuses on Semiconductor Packaging & Testing. It was held for the 15th time, this time in Jiangyin, China. Directed by Department of Electronics Information, the Ministry of Industry and Information Technology of the People’s Republic of China and Chinese Institute of Electronics is organized by China Semiconductor Industry Association.
Bond testing seminar
Click here to apply for a bond testing seminar.