Fig. 4 This system can be configured with any combination of sensors and tools for pull, push and shear from a fraction of a gram force to 200kgf
Fig. 4 This system can be configured with any combination of sensors and tools for pull, push and shear from a fraction of a gram force to 200kgf

Is Fully Automatic Bond Testing Possible? » What is Possible with Modern Automation?

What is Possible with Modern Automation

Looking at each of the previously mentioned requirements for full automation in turn,

Multiple test heads

Fig. 5 For applications requiring more than 6 test sensors the head can be exchanged in seconds
Fig. 5 For applications requiring more than 6 test sensors the head can be exchanged in seconds

A bond tester with 6 automatically selectable test heads is sufficient for the vast majority of applications (Fig 4). When this is not sufficient, a quick release multiple test head can be a solution (Fig 5).

Accurate tool positioning

A tool to sample positional accuracy of ±10µm is adequate for most bond test applications. This can be achieved on bond testers with precision axis that have backlash free drives and mapped linear positional encoders. Better accuracies in the region of ±5µm can be achieved with local fiducial alignment. Systems with rotary encoders (fitted to the drive motors) will have an accuracy of no better than ±50µm which is very often insufficient. Tool rotation accuracy should be ±1° or better.

Fig. 6 Manual hook concentricity adjustment - 10µm concentricity possible
Fig. 6 Manual hook concentricity adjustment - 10µm concentricity possible

In wire pull, to ensure only one (and the correct wire is tested), good hook concentricity is essential. A hook concentricity of 10µm being sufficient for most applications. Hook concentricity enables the extremely useful “Auto-hook” where the hook is automatically rotated by 90° during a test. It can be noted that a concentricity of 10µm results in a maximum 5µm positional error as a result of the 90° rotation. This degree of concentricity can only be achieved by adjusting the hook when it is mounted on the sensor shaft.

Hooks are typically delicate and even the slightest collision will affect/destroy a good concentricity. If the hook concentricity can be easily adjusted they can be reset in most cases. A modern bond tester will have such mechanical adjustment (Fig 6) but also software correction (Fig 7). With the two systems, combined hook concentricity’s in the region of 5µm can be achieved. Systems that rely on interchangeable and preset concentricity can achieve at best 25µm and in the event of a collision have no means of being reset.

Continue to read:

  1. Introduction
  2. What is Required for Automation?
  3. What is Possible with Modern Automation?
  4. Non-Destruct Testing
  5. Conclusion

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