Research partners
XYZTEC lead the field with their own research and collaboration with other semiconductor and electronic innovators. Some of our partners are listed on this page. References are listed here.
See also: XYZTEC Sales Director Dirk Schade joins the IMAPS board.
Events
| 03..05 | Mar | IMAPS Device Packaging 2020 |
| 18 | Mar | IMAPS Frühjahrskonferenz Germany 2020 |
| 18..20 | Mar | Productronica China 2020 |
| 18..20 | Mar | Semicon China 2020 |
| 24..26 | Mar | Adhesives & Bonding Expo 2020 |
| 16..17 | Apr | PSIC China 2020 |
| 28..29 | Apr | 9th CAM workshop Germany 2020 |
| 05..07 | May | SMTconnect 2020 |
| 26..29 | May | ECTC 2020 |
| 27..29 | May | NEPCON Korea 2020 |
Bond testing seminars
If you are looking to increase your knowledge about bond testing, consider attending a bond testing seminar.
Solution industries
- Aerospace
- Automotive
- Hybrid and substrate
- LED
- Medical devices
- PCB assembly
- Power devices
- Research & Development
- Semiconductor
- Solar
Test types
- Ball shear / Solder ball shear
- Bending
- Cavity shear
- Cold Bump Pull
- Copper pillar
- Creep test
- Die shear
- Fatigue
- High speed impact
- Lead integrity / Micro torsion
- Lid pull
- Lid torque
- Loop height
- Overhanging die
- Passivation layer gold ball shear
- Probe test
- Ribbon peel
- Ribbon pull
- Scratch / coating
- SMD shear
- SMD gull wing leads
- Spring rigidity
- Stud pull
- Total Ball Shear / Zone shear
- Tweezer pull
- Vector pull
- Wedge and ribbon shear
- Wire pull
Events
| 03..05 | Mar | IMAPS Device Packaging 2020 |
| 18 | Mar | IMAPS Frühjahrskonferenz Germany 2020 |
| 18..20 | Mar | Productronica China 2020 |
| 18..20 | Mar | Semicon China 2020 |
| 24..26 | Mar | Adhesives & Bonding Expo 2020 |
| 16..17 | Apr | PSIC China 2020 |
| 28..29 | Apr | 9th CAM workshop Germany 2020 |
| 05..07 | May | SMTconnect 2020 |
| 26..29 | May | ECTC 2020 |
| 27..29 | May | NEPCON Korea 2020 |
Bond testing seminars
If you are looking to increase your knowledge about bond testing, consider attending a bond testing seminar.
Solution industries
- Aerospace
- Automotive
- Hybrid and substrate
- LED
- Medical devices
- PCB assembly
- Power devices
- Research & Development
- Semiconductor
- Solar
Test types
- Ball shear / Solder ball shear
- Bending
- Cavity shear
- Cold Bump Pull
- Copper pillar
- Creep test
- Die shear
- Fatigue
- High speed impact
- Lead integrity / Micro torsion
- Lid pull
- Lid torque
- Loop height
- Overhanging die
- Passivation layer gold ball shear
- Probe test
- Ribbon peel
- Ribbon pull
- Scratch / coating
- SMD shear
- SMD gull wing leads
- Spring rigidity
- Stud pull
- Total Ball Shear / Zone shear
- Tweezer pull
- Vector pull
- Wedge and ribbon shear
- Wire pull