Successful ESTC Conference in Dresden, Germany

20 СЕНТЯБРЬ 2018

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. XYZTEC, technology leader in bond testing, was present to discuss and share information about fully automated bond testing.

This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

Newsletters

АВГ 2018 Is Fully Automatic Bond Testing Possible?
ИЮЛ 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
МАЙ 2017 Shear testing copper pillar
МАР 2017 Fracture strength of thin wafers and die
ФЕВ 2017 Centralized database for enhanced security and SPC options
ЯНВ 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
ДЕК 2016 Тестирование покрытий и пленок
НОЯ 2016 Latest software release enables automatic grading
ОКТ 2016 Новые возможности в тестировании материалов
СЕН 2016 Тестирование изделия с крышкой на установке Condor Sigma
АВГ 2016 Новый нагреваемый вращающийся рабочий столик для установки Condor Sigma W12 имеет большую рабочую зону
ИЮЛ 2016 How to: Wire Pull

 
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14 ИЮН Purchase wire hooks, shear tools, tweezer tips by PayPal


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