31 ИЮЛЬ 2017
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
The first difficulty is the reduction in test load area to bond area as the die becomes thinner. This is especially problematic when shear testing, because there is less area to apply the test load to. As the die thickness reduces there comes a point when the test load stress between the tool and the die reaches its yield value before the bond reaches its yield stress. The die then fails before the bond and the bond strength is not measured.
The second difficulty relates to both shear and stud pull testing, namely the fact that die and substrate warpage with thin die are likely to occur. When shear testing, warped die and substrate increase buckling loads on the die that can cause it to fracture before the bond fails. For stud pull, warpage makes a strong and consistent glue layer thickness between the stud and die difficult.
To obtain the failure mode of interest i.e. a bond failure, we must be able to load the bond to the highest force possible. XYZTEC has achieved positive results by combining several techniques to significantly increase the maximum loads possible. The picture shows our patented 45° self aligning top landing tool.
Flip chip and soldered die applications have been successfully sheared, applying up to 1200MPa on the side edge of die.
XYZTEC is market leader in bond testing. We continue to develop solutions for all types of industries including solar, space, military, medical, automotive, interconnect and material science. Our customers include market leaders in all of these industries throughout the world. Owning the best quality assurance tells your customers what you priorities are. Request a live demonstration of the Condor Sigma on your sample and contact us today!
|ИЮЛ 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|МАЙ 2017||Shear testing copper pillar|
|МАР 2017||Fracture strength of thin wafers and die|
|ФЕВ 2017||Centralized database for enhanced security and SPC options|
|ЯНВ 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|ДЕК 2016||Тестирование покрытий и пленок|
|НОЯ 2016||Latest software release enables automatic grading|
|ОКТ 2016||Новые возможности в тестировании материалов|
|СЕН 2016||Тестирование изделия с крышкой на установке Condor Sigma|
|АВГ 2016||Новый нагреваемый вращающийся рабочий столик для установки Condor Sigma W12 имеет большую рабочую зону|
|ИЮЛ 2016||How to: Wire Pull|
|ИЮН 2016||Get 10% off your next tools order|
|МАЙ 2016||Pull testing bumped wafers|
|АПР 2016||SMD gull wing leads testing|
|МАР 2016||Automation: matrix bond testing made easy|
|ФЕВ 2016||Fully integrated solution for automated wafer testing|
|ЯНВ 2016||In bond testing, size does matter|
|ДЕК 2015||XYZTEC goes from strength to strength|
|НОЯ 2015||Automatic wire detect|
|ОКТ 2015||Highly reproducible stud pull tests are possible|
|СЕН 2015||What is the quality of your coatings?|
|АВГ 2015||Loading samples has never been so easy|
|ИЮЛ 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|ИЮН 2015||Increase your bondtesting throughput|
|МАЙ 2015||USB Tweezers|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.