Newsletter: Advances in Thin, 3D and MEMS Die Bond Strength Testing

31 ИЮЛЬ 2017

As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:

The reduced ratio of die thickness to die bond area
The reduced ratio of die thickness to die bond area

The first difficulty is the reduction in test load area to bond area as the die becomes thinner. This is especially problematic when shear testing, because there is less area to apply the test load to. As the die thickness reduces there comes a point when the test load stress between the tool and the die reaches its yield value before the bond reaches its yield stress. The die then fails before the bond and the bond strength is not measured.

Warped die and substrate increases buckling loads on die that can cause it to fracture before the bond fails
Warped die and substrate increases buckling loads on die that can cause it to fracture before the bond fails

The second difficulty relates to both shear and stud pull testing, namely the fact that die and substrate warpage with thin die are likely to occur. When shear testing, warped die and substrate increase buckling loads on the die that can cause it to fracture before the bond fails. For stud pull, warpage makes a strong and consistent glue layer thickness between the stud and die difficult.

Thirdly, when silicon is directly bonded to silicon or other similar materials the bond strength is very high. This makes testing exceptionally difficult, both when performing shear and stud pull.

Maximum recorded stress on the die edge up to 1200MPa

45° Self aligning top landing tool
45° Self aligning top landing tool

To obtain the failure mode of interest i.e. a bond failure, we must be able to load the bond to the highest force possible. XYZTEC has achieved positive results by combining several techniques to significantly increase the maximum loads possible. The picture shows our patented 45° self aligning top landing tool.

Flip chip and soldered die applications have been successfully sheared, applying up to 1200MPa on the side edge of die.

Put the Condor Sigma to the test!

XYZTEC is market leader in bond testing. We continue to develop solutions for all types of industries including solar, space, military, medical, automotive, interconnect and material science. Our customers include market leaders in all of these industries throughout the world. Owning the best quality assurance tells your customers what you priorities are. Request a live demonstration of the Condor Sigma on your sample and contact us today!

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Other newsletters

ИЮЛ 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
МАЙ 2017 Shear testing copper pillar
МАР 2017 Fracture strength of thin wafers and die
ФЕВ 2017 Centralized database for enhanced security and SPC options
ЯНВ 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
ДЕК 2016 Тестирование покрытий и пленок
НОЯ 2016 Latest software release enables automatic grading
ОКТ 2016 Новые возможности в тестировании материалов
СЕН 2016 Тестирование изделия с крышкой на установке Condor Sigma
АВГ 2016 Новый нагреваемый вращающийся рабочий столик для установки Condor Sigma W12 имеет большую рабочую зону
ИЮЛ 2016 How to: Wire Pull
ИЮН 2016 Get 10% off your next tools order
МАЙ 2016 Pull testing bumped wafers
АПР 2016 SMD gull wing leads testing
МАР 2016 Automation: matrix bond testing made easy
ФЕВ 2016 Fully integrated solution for automated wafer testing
ЯНВ 2016 In bond testing, size does matter
ДЕК 2015 XYZTEC goes from strength to strength
НОЯ 2015 Automatic wire detect
ОКТ 2015 Highly reproducible stud pull tests are possible
СЕН 2015 What is the quality of your coatings?
АВГ 2015 Loading samples has never been so easy
ИЮЛ 2015 Axis accuracy of ±1µm: essential for automatic bond testing
ИЮН 2015 Increase your bondtesting throughput
МАЙ 2015 USB Tweezers

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Bond testing seminars

Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.


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