29 АВГУСТ 2018
Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is possible with a modern bond testing system.
In its infancy bond testing was wire pull, followed by die and ball shear. It evolved to satisfy the ever increasing diverse range of semiconductor and electronic applications. This requirement continued to evolve requiring ever more advanced test methods to keep pace with new technology. This became the first priority and kept bond tester designers busy. If bond testing needed to test all the bonds being made, full automation would have been developed from the very beginning. But as only a relatively small number of bonds required testing, the development and capital cost equations of bond testing differed from that of production machines. Attempts were made to add automation but most cases lacked the resources and ultimate commitment from both equipment suppliers and end users to provide what the industry might expect. Being involved from the beginning, always wanting to achieve full automation and born of experience rather than capital investment, a few very experienced bond tester designers started to see how it might be achieved.
There was never any doubt about the benefits of automation. Apart from the obvious saving in operating costs it should be faster, but perhaps most importantly it could test more consistently and accurately. The only justification for bond testing at all is to measure the quality of your bonds and in so doing maintain and improve, production yield and product reliability. This being the only reason for a bond tester’s existence should make accuracy the highest priority for any bond tester designer.
|АВГ 2018||Is Fully Automatic Bond Testing Possible?|
|ИЮЛ 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|МАЙ 2017||Shear testing copper pillar|
|МАР 2017||Fracture strength of thin wafers and die|
|ФЕВ 2017||Centralized database for enhanced security and SPC options|
|ЯНВ 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|ДЕК 2016||Тестирование покрытий и пленок|
|НОЯ 2016||Latest software release enables automatic grading|
|ОКТ 2016||Новые возможности в тестировании материалов|
|СЕН 2016||Тестирование изделия с крышкой на установке Condor Sigma|
|АВГ 2016||Новый нагреваемый вращающийся рабочий столик для установки Condor Sigma W12 имеет большую рабочую зону|
|ИЮЛ 2016||How to: Wire Pull|
|ИЮН 2016||Get 10% off your next tools order|
|МАЙ 2016||Pull testing bumped wafers|
|АПР 2016||SMD gull wing leads testing|
|МАР 2016||Automation: matrix bond testing made easy|
|ФЕВ 2016||Fully integrated solution for automated wafer testing|
|ЯНВ 2016||In bond testing, size does matter|
|ДЕК 2015||XYZTEC goes from strength to strength|
|НОЯ 2015||Automatic wire detect|
|ОКТ 2015||Highly reproducible stud pull tests are possible|
|СЕН 2015||What is the quality of your coatings?|
|АВГ 2015||Loading samples has never been so easy|
|ИЮЛ 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|ИЮН 2015||Increase your bondtesting throughput|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.