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- Article: Is fully automatic bond testing possible?
- P2: What is Required for Automation?
- P3: What is Possible with Modern Automation?
- P4: Automatic load and unload
- P5: Machine Vision
- P6: Measurement of gross sample position, bonds
- P7: Automatic failure mode analysis
- P8: Test debris management
- P9: Non-Destruct Testing and Conclusion
- Why test bonds?
- P2: Shear testing
- P3: Solder bump testing, die pull applications
- P4: Conclusion
- How to test bonds
- How to: Cold Bump Pull
- Cold Bump Pull objectives and jaw size
- Cold Bump Pull jaw quality
- Cold Bump Pull setting up and doing a test #1
- Cold Bump Pull setting up and doing a test #2
- Cold Bump Pull tweezers and test sequence recap
- Cold Bump Pull test force, cleaning and jedec
- How to: Wire Pull
- Wire Pull Tool design and quality
- Wire Pull Alignment
- Wire Pull Loop height measurement and work holder
- Wire Pull Variants: vector pull, gull wing leads
- Wire Pull Test method settings
- Wire Pull Failure modes
- Wire Pull Force calculations
- MIL-STD-883 2011.9 bond strength (bond pull test)
- MIL-STD-883 2023.7 nondestructive bond pull
- MIL-STD-883 2023.7 Appendix A
- MIL-STD-883 2004.7 lead integrity
- MIL-STD-883 2004.7 A - Tension
- MIL-STD-883 2004.7 A1 Lead braze integrity
- MIL-STD-883 2004.7 B1 Bending stress
- MIL-STD-883 2004.7 B2 Lead fatigue
- MIL-STD-883 2004.7 C1 Lead torque
- MIL-STD-883 2004.7 C2 Stud torque
- MIL-STD-883 2004.7 D Solder pad adhesion
- MIL-STD-883 2004.7 E Lead plating integrity
- MIL-STD-883 2024.2 Lid torque glass-frit-sealed
- MIL-STD-883 2019.9 Die shear strength
- MIL-STD-883 2031.1 Flip chip pull off test
- How to: Tweezer Pull
- Tweezer Pull Tweezer Design
- Tweezer Pull Alignment and Failure Modes
- Tweezer Pull Ribbon Pull and Peel
- Tweezer Pull Copper Pillar
- Tweezer Pull Stud Pull and Pick and Place
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- Visit us in Tokyo this month
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- Meet us worldwide in September
- Teaming up with Micronnect B.V. and BRIDGE S.r.l.
- Newest Sigma HF High Force bond tester live in action at SMTconnect
- XYZTEC spreads bond testing knowledge to partners worldwide
- Visit us at Semicon China
- XYZTEC at Semicon Korea
- Presentation at CSPT 2018
- Matelec show 2018 for the Electrical and Electronics Industry with Antycip
- Successful ESTC Conference in Dresden, Germany
- LEGO® for Nepal sponsored by XYZTEC
- Visit us at SMT Hybrid Packaging Nuremberg
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- XYZTEC workshop at IMAPS UK
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- Presentation at CSPT 2017 by Bob Sykes
- Condor Sigma in São Paulo, Brazil
- Fully automatic lead frame tester introduced at SMT Hybrid Packaging
- Semicon Penang 2017 successful
- Pizza and Go cart racing at K1 Speed in Northern CA
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- Job opening for Junior Mechanical Design Engineer [closed]
- Successful seminar in Russia with Sovtest
- Market leading Condor Sigma bond tester at TPCA Taiwan
- Automation features draw attention at Semicon Taiwan 2016
- HTMG represents XYZTEC in South America
- Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT) [UPDATED]
- Purchase wire hooks, shear tools, tweezer tips by PayPal
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- HiSOL new distributor in Japan
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- Wire detect functionality popular at Productronica
- How to: Cold Bump Pull
- Condor Sigma draws attention at Semicon Taiwan
- Exciting sales and service meeting in Bangkok
- Bond Test Measurement Accuracy
- Condor Sigma software now available in Vietnamese
- Automatic wire detection draws attention at SMT 2015
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- More on loop height testing
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- Copper pillar testing
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- XYZTEC shows full automation on the Condor Sigma at the SMT 2014 in Nürnberg
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- Spring rigidity test
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- A bond tester that can grow with your company
- Condor Sigma wins Red Dot design award 2013
- Condor Sigma draws attention at Semicon China
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- 3H Corporation new distributor in Korea
- Heraeus: XYZTEC class A supplier
- Crockett Southwest new XYZTEC sales partner in Texas, Oklahoma, Louisiana and Arkansas
- GIO Award for Condor Sigma
- Alternative Testing Methods for Electronic Assemblies
- USB Tweezers: a unique electrically actuated micro grippers solution
- NW Test Solutions to represent XYZTEC in Pacific Northwest
- Condor Sigma nominated for European Aluminium Award 2012
- Visit us at Semicon Taiwan 2012 in Taipei
- New uni-axial bending test for ultra-thin die
- Busy first show for Tom Haley
- XYZTEC welcomes new sales manager for United States and Canada
- Condor Sigma at Dutch Technology Week 2012
- Condor Sigma attracts attention on ECTC 2012
- High interest in self-alignment tool on Fraunhofer Technology Day
- Introduction of Sigma at Semicon Korea
- Condor Sigma in Japan
- Interelec Electronics AG switches to XYZTEC
- Successful seminar at Tianjin University on Packaging High-temperature Electronics
- Condor Sigma: Performance and Flexibility
- New test method for mechanical strength evaluation of solar cell solder joints
- Case studies: Danfoss, flexibility and deep access
- Fully automated LED wafer testing
- Employees donate to Japan relief effort
- XYZTEC participates in Solar Module Value Chain for International BIPV Concepts
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- Aubert Dupont speaks at IEEE CPMT 2010
- XYZTEC launches new website
- Charity event for RETT syndrome big success
- Technical Informer: USB Tweezers
- XYZTEC introduces Condor EZ: the next generation in bond testing
- Technical Informer: Solar Cell Ribbon Peel Testing
- Bob Sykes joins XYZTEC
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- Is Fully Automatic Bond Testing Possible?
- Advances in Thin, 3D and MEMS Die Bond Strength Testing
- Shear testing copper pillar
- Fracture strength of thin wafers and die
- Centralized database for enhanced security and SPC options
- Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
- Тестирование покрытий и пленок
- Latest software release enables automatic grading
- Новые возможности в тестировании материалов
- Тестирование изделия с крышкой на установке Condor Sigma
- Новый нагреваемый вращающийся рабочий столик для установки Condor Sigma W12 имеет большую рабочую зону
- How to: Wire Pull
- Get 10% off your next tools order
- Pull testing bumped wafers
- SMD gull wing leads testing
- Automation: matrix bond testing made easy
- Fully integrated solution for automated wafer testing
- In bond testing, size does matter
- XYZTEC goes from strength to strength
- Automatic wire detect
- Highly reproducible stud pull tests are possible
- What is the quality of your coatings?
- Loading samples has never been so easy
- Axis accuracy of ±1µm: essential for automatic bond testing
- Increase your bondtesting throughput
- USB Tweezers
- Analyze not only forces but also distances on your product
- Technology leader XYZTEC raises the bar in bond testing once again with new software release
- Why all bond testers should have an RMU
- Copper pillar testing
- Is process verification important to your business?
- Fully automated bond tester
- Ideal solution for 300mm (12 inch) wafer testing
Condor Sigma
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Test types
- Bending
- Cavity shear
- Cold Bump Pull (CBP)
- Connector Test
- Copper pillar
- Creep test
- Die shear
- Fatigue
- Gold ball shear and Solder ball shear
- High speed impact
- keypad
- Lead integrity / Micro torsion test
- Lid pull
- Lid torque
- Loop height test
- Overhanging die
- Passivation layer gold ball shear
- Probe test
- Ribbon peel
- Ribbon pull
- Scratch test / coating test
- SMD Gull Wing Leads
- SMD shear
- Spring rigidity
- Stud pull
- Total Ball Shear (TBS) / Zone shear
- Tweezer pull
- Vector pull
- Wedge shear
- Wire pull
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