|31 ИЮЛ||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|19 ИЮЛ||XYZTEC granted subsidy for further accuracy improvements|
|23 ИЮН||Presentation at CSPT 2017 by Bob Sykes|
|06 ИЮН||Condor Sigma in São Paulo, Brazil|
|31 МАЙ||Shear testing copper pillar|
|16 МАЙ||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|28 АПР||Semicon Penang 2017 successful|
|28 АПР||Pizza and Go cart racing at K1 Speed in Northern CA|
|31 МАР||Fracture strength of thin wafers and die|
|14 МАР||Visit us at Semicon China|
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