Why test bonds? » conclusion

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The subject of bond testing is far ranging and varied but the value that it contributes to ensuring product quality cannot be overlooked. Precise force displacement measurement using a modern bond tester allows bond strength modeling that can successfully predict the various failure modes and can be used as an accurate prediction model of real life loading conditions.

This article originally appeared in the June 2010 issue of Global SMT & Packaging magazine

Article overview:

How to: Cold Bump Pull and Wire Pull

We have added an extensive how-to on Cold Bump Pull (CBP) and one on Wire Pull to our website. By doing this we aim to spread knowledge about bond testing in the industry. Click here to go there.

Condor Sigma

Click here for more information about the Condor Sigma bond tester and its unique properties.

Bond testing seminars

If you are looking to increase your knowledge about bond testing, consider attending a bond testing seminar.

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