Condor Sigma W12 是針對 300mm (12吋)晶圓測試的最佳解決方案
Condor Sigma W12 是針對 300mm (12吋)晶圓測試的最佳解決方案

Condor Sigma W12

最佳解決方案: 針對300mm(12吋)晶圓測試

  • 高精度的推力測試和bump 拉拔測試(Cold Bump Pull, CBP)
  • Big bump removal to prepare for wafer probing
  • 可測試尺寸小於20µm 的bump
  • Available with or without wafer handler (EFEM)
  • 可根據Mapping資訊, 直接輸入欲到達位置的X,Y座標
  • 失效模式分級功能,可自動將測試點移到高倍顯微鏡下方, 透過21”螢幕觀看,方便及快速失效分析
  • Up to 4 USB Tweezers in 1 RMU
  • 快速簡便的對位功能
  • 高解析度的Camera, 可搭配高低不同倍率鏡頭
  • 在晶圓推力測試, 目前業內最快的UPH產出
  • Wafer pusher and wafer chuck cleaner besides the wafer loading arm
    Wafer pusher and wafer chuck cleaner besides the wafer loading arm
  • 工作範圍: 500mm X 軸, 370mm Y 軸, 深度 400mm
  • 整合報告編輯軟體和有彈性的資料輸出
  • 可100% 到達300mm 任何一個位置, 不需重新置放或人為移動
  • 殘錫自動清除單元
  • 晶圓承載平台搭配安全鎖裝置,可360 度旋轉
  • 晶圓承載平台會被機構鎖住, 當真空處於供應狀態
  • 符合JEDEC JESD22-B117A, JEDEC JESD22-B115, JEITA EIAJ ET-7407 and IPC-9708 標準
  • 也可以適用在200mm(8”吋)或其他晶圓尺寸
  • 24 位元 ADC 解析度, 10kHz 取樣頻率
  • 可搭配六合一旋轉模組或單一功能模組
  • SECS/GEM protocol
  • Wafer pusher to test warped wafers
  • 獨一無二的高精度0.075%

Sigma W12 Wafer chuck
Sigma W12 Wafer 載具

Condor Sigma W12特別設計在晶圓上,來執行高精密的推力測試和bump拉力(CBP)測試. 系統搭配目前業界最大尺寸和最快速度的X/Y 載台, 來確保測試工具和camera ,可以最快速到達和測試300mm wafer 上的任何一個位置. 內置的30nm高解析度光學尺確保了高精度的定位.

Condor Sigma也搭配了全自動化功能,來執行快速測試,不管在wafer 上的任一位置. 標靶辨識系統可以保證定位的高重複性. Camera 也協助操作員快速的執行失效模式的判讀分級. 在一連串的測試之後, 執行失效模式的功能, 可透過Camera 和21”螢幕觀看,方便及快速的分級.

Blower and vacuum tool cleaning unit mounted around the shear tool.  The unit is not connected to the cartridge, but to the machine frame.
吹氣和真空裝置(殘錫清除系統)被安裝在推刀周圍. 這系統主要是安裝在機台本體機構而非測試模組上.

The Condor Sigma W12 可以被安裝兩個垂直Camera 和一個在顯微鏡上的camera. 我們建議使用一個低倍率和一個高倍率的鏡頭來得到最佳的定位和失效模式分級. 第二個螢幕將可隨時展示顯微鏡上的camera 所拍攝的Live 即時畫面..

To prepare for wafer probing, big bumps need to be removed by shearing them off and cleaning any debris. Fully programmable vision algorithms are used to check if big bumps are successfully removed.

可裝配XYZTEC Revolving Measurement Unit (RMU) 六合一旋轉模塊( RMU), 確保你可以切換不同測試和工具, 只需按一個按鍵. 沒有用到的模塊(sensors) 會被保護在機台內. The RMU can hold up to 6 sensors in any combination, including up to 4 USB Tweezers.

The Condor Sigma W12 software allows the operator to quickly and accurately jump to the next test point
The Condor Sigma W12 軟體允許使用者快速和精準的跳到下一個測試點

新的 XY Mapping 功能可以讓操作員快速和準確的從一個位置移動到下一個位置, 只需輸入相位置., 當然, Sigma W12 被裝置了30nm的光學尺來確保0.5µm的重現性..

Together with the market leaders of wafer handling equipment we offer a fully integrated and automated solution
Together with the market leaders of wafer handling equipment we offer a fully integrated and automated solution

Wafer handlers (EFEM)

The Condor Sigma W12 can be integrated with various types of wafer handlers (Equipment Front End Module, EFEM). Integration transforms the bond tester into a fully automated system.

We offer leading edge products for up to 300 mm equipment frontend module platforms.

Among our customers are the world’s top 4 semiconductor packaging houses, which require high precision, fully automated, low vibration, maximum throughput and extensive safety features.

The Condor Sigma W12 features automatic wafer size detection, PID controlled centered lift pins for with guaranteed secure wafer loading and un-loading.

Please contact us for more information and your specific wishes. We have experience with various wafer handler suppliers.

SECS/GEM

Among other protocols, XYZTEC offers SECS/GEM communication directly in the Condor Sigma software or via an EFEM. Contact XYZTEC for more information and options for your factory.


Videos of the W12 in action

Condor Sigma bond tester integrated in Rorze wafer handler for fully automatic 300mm wafer testing

Ideal solution for 300mm (12 inch) wafer testing


Condor Sigma W12 裝上了校正夾具
Condor Sigma W12 裝上了校正夾具

詳細規格

點擊這裡確認規格 and see whether the Sigma W12是否 Sigma W12 是你所需要的系統或是你需要不同型號的Condor 機台.


Condor Sigma W12 sideview
Condor Sigma W12 sideview

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