In this newsletter, we describe the exciting new features XYZTEC has incorporated in its latest Condor Sigma software release. Customers are recommended to upgrade, so they can benefit from all the new free features. The advanced Halcon fiducial recognition and SECS/GEM may require additional licences.
One of the most exciting additions in version 5.8 of the Condor Sigma software is automatic grading for ball shear testing. Using the advanced Halcon library and high resolution perpendicular cameras with smart lighting systems, we have achieved successful determinations of failure modes for several customers. The computer can accurately determine the percentages of brittle and ductile failures.
The same library is also used for advanced fiducial recognition for applications that have difficult and inconsistent fiducial marks or where no fiducial marks exist enabling other features to be used. The advanced shape recognition features of Halcon allow engineers to use separate color channels and several image filters. Image segmentation techniques can help to further isolate the unique features that the engineer is interested in. The result can be used as the basis for positioning correction (for example wire detect).
Several small changes to the status bar make the software easier to work with. For example, it is now possible to change the working position and selected camera by a simple click.
Using composite surface imaging techniques, it is possible to accurately determine the heights of a feature on your sample. This can be used for multiple purposes, like determining loop heights without actually touching the wire. It is also possible to produce images wherein everything is in focus.
The programming of an automation sequence just got a whole lot easier, with the possibility to execute fiducials during programming. Even if the sample has slightly moved or is replaced with a different sample, running the fiducials from the editor will ensure that added or changed test positions and commands are correct.
Automation programming can now be done from the tool position or either of the camera systems on your Sigma. Another improvement is that it is now possible to check fiducials against multiple photos so that failed recognitions during the automation runs occur less often.
Several small and large improvements were made for wafer testing. Among other things, version 5.8 provides enhanced support of wafer tables with vacuum detect sensors. The engineer also gets more flexibility when working with the patented contactless CBP Jaw Cleaner. The standard cleaning process is improved and large wafer maps are displayed better and faster. Click here to see our latest W12 automation video.
SECS/GEM is an equipment interface protocol for equipment-to-host data communications in the semiconductor industry. Among other protocols, XYZTEC offers SECS/GEM communication directly in the Condor Sigma software or via an EFEM. Contact XYZTEC for more information and options for your factory.
A built-in export editor is introduced. This enables the engineer to create his own reports in almost any format, to be saved to a file or the clipboard.
The Condor Sigma software also has improved networking support. Multiple bond testers can now share a centralized database. In close cooperation with our customers, we made sure it is possible to share certain settings while keeping others machine specific.
Click here to download Condor Sigma software version 5.8 and upgrade now. Contact your local XYZTEC distributor to assist you if required.
References are available and happily provided.
|2017年7月||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|2017年5月||Shear testing copper pillar|
|2017年3月||Fracture strength of thin wafers and die|
|2017年2月||Centralized database for enhanced security and SPC options|
|2017年1月||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|2016年12月||Coating and film testing|
|2016年11月||Latest software release enables automatic grading|
|2016年10月||Vision enhanced materials testing|
|2016年9月||XYZTEC makes lid pull easy|
|2016年8月||Condor Sigma W12 with large heater stage|
|2016年7月||How to: Wire Pull|
|2016年6月||Get 10% off your next tools order|
|2016年5月||Pull testing bumped wafers|
|2016年4月||SMD gull wing leads testing|
|2016年3月||Automation: matrix bond testing made easy|
|2016年2月||Fully integrated solution for automated wafer testing|
|2016年1月||In bond testing, size does matter|
|2015年12月||XYZTEC goes from strength to strength|
|2015年11月||Automatic wire detect|
|2015年10月||Highly reproducible stud pull tests are possible|
|2015年9月||刮痕測試 / 鍍膜測試|
|2015年8月||Loading samples has never been so easy|
|2015年7月||Axis accuracy of ±1µm: essential for automatic bond testing|
|2015年6月||Increase your bondtesting throughput|