在半導體電子業, 保持高品質的鍍膜和鍍層是一件很重要的要求. XYZTEC “刮痕測試”(PDF) 提供一個新的方法來量測黏膠層, 不論是在基板或其他材料的單一層或多層鍍膜. 就如影片所展示, 特製的推刀被使用於接觸在單一層或多層鍍膜.
並沿著鍍膜表面執行刮痕測試. Another excellent solution is to use a diamond Nano Indenter tip.
被切入和刮入的測試深度, 可以被可程式化的接觸力設定來控制. 因此有能力將推刀壓入單一層或多層鍍膜到可程式化控制的深度. 薄弱的連結層可以從該層的失效模式, 推刀的力與位移曲線圖被觀察出來. 在這個範例中展示好的和壞的連結層, 可以輕易被觀察出來.
There are three standard procedures for scratch testing;
As with any scratch tester the quality of the bond between layers can be seen in the failure mode and force displacement graph. The examples in the picture below show the same PLST on multi layer films of different constructions.
Additional failure mode analysis such as EDX helps to show at what point layers fail. With this deeper understanding quality assurance may subsequently only require scratch testing.
The Condor Sigma is a highly flexible micro materials tester specifically designed for the semiconductor and electronics industry. From its very beginning it was designed for easy and comfortable manual use, making it much faster than any dedicated scratch tester.
Its fully automatic mode delivers even more benefit. Samples are simply loaded and tested. The Sigma has fiducial mark pattern recognition to locate the samples position and then tests with precision with whatever combination of scratch tests you want. These can be different positions, procedures, directions and speeds. Being automatic, every sample is tested in exactly the same way.
In a recent application, a product that required 1 day to test takes a mere 2 minutes on the Condor Sigma!
Please contact us if you have any questions or special bond testing requirements.
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