Wire Pull Testing applies an upward force under the wire, effectively pulling it away from the substrate. There are many types of pull tests, therefore XYZTEC offers a solution for each type. The pull test can be performed on wires or ribbons. The material of the wires or ribbons is mostly gold, aluminium or copper.
Majority of tests on wirebonds are performed with a 90° hook that is positioned under the wire. The Z-stage then moves up and the wire is pulled. The alignment of the hook under the wire is very important to obtain reproducible measurements. This can be ensured using our semi-automatic or fully automatic testing compliant with DVS2811.
As more and more companies are making the transition to automatic wire pull testing, the engineers are also finding out its limitations. On many products, the placement of wires is not consistent and simple automation programs will miss the wire or pull two wires at once.
The illustration shows how the hook is driven to a corrected position, after the wire was detected at the position of the green crosshairs. Thereafter, when the bond tester performs the pull test, it does not miss the wire but pull it in exactly the same position as every other wire. This enables a higher degree of consistency than possible when doing manual tests.
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